TY - GEN
T1 - Formalization and Verification of the ICC Mechanism in Android System Using CSP
AU - Lv, Yixiao
AU - Yin, Jiaqi
AU - Chen, Sini
AU - Zhu, Huibiao
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - With the rapid development of mobile computing technology, Android System is widely used in smart devices, and the quantity of Android Apps continuously grows. The Inter-Component Communication (ICC) mechanism in the Android framework allows communication between components (inside the same App or on different Apps). However, some security issues are caused by this mechanism, especially in the case of Inter-App Communication (IAC). To ensure the security of the communication in Android System, we formally model the ICC mechanism using Communication Sequential Process (CSP). After that, we verify four properties of the model using the Process Analysis Toolkit (PAT) with the help of C#, including Deadlock Freedom, Data Reachability, Data Security, and Data Reliability.
AB - With the rapid development of mobile computing technology, Android System is widely used in smart devices, and the quantity of Android Apps continuously grows. The Inter-Component Communication (ICC) mechanism in the Android framework allows communication between components (inside the same App or on different Apps). However, some security issues are caused by this mechanism, especially in the case of Inter-App Communication (IAC). To ensure the security of the communication in Android System, we formally model the ICC mechanism using Communication Sequential Process (CSP). After that, we verify four properties of the model using the Process Analysis Toolkit (PAT) with the help of C#, including Deadlock Freedom, Data Reachability, Data Security, and Data Reliability.
KW - Android
KW - Communicating Sequential Process (CSP)
KW - Inter-App Communication (IAC)
KW - Inter-Component Communication (ICC)
KW - PAT with C#
UR - http://www.scopus.com/inward/record.url?scp=85178510692&partnerID=8YFLogxK
U2 - 10.1109/ISSREW60843.2023.00053
DO - 10.1109/ISSREW60843.2023.00053
M3 - 会议稿件
AN - SCOPUS:85178510692
T3 - Proceedings - 2023 IEEE 34th International Symposium on Software Reliability Engineering Workshop, ISSREW 2023
SP - 89
EP - 95
BT - Proceedings - 2023 IEEE 34th International Symposium on Software Reliability Engineering Workshop, ISSREW 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 34th IEEE International Symposium on Software Reliability Engineering Workshop, ISSREW 2023
Y2 - 9 October 2023 through 12 October 2023
ER -