Estimating the constitutive behaviour of sintered silver nanoparticles by nanoindentation

Xu Long, Wenbin Tang, Johan Liu, Xiuzhen Lu, Cheng Zhou, Weijuan Xia, Yanpei Wu

科研成果: 书/报告/会议事项章节会议稿件同行评审

5 引用 (Scopus)

摘要

With the regulation of lead-free packaging materials and the rapid miniaturization of electronic packaging device, power density significantly increases and therefore thermal management becomes a limiting factor. Among the material candidates, the sintered silver nanoparticles (AgNPs) own superior electrical and thermal conductivities. More importantly, due to scale effect, the reduction of particle size down to nanoscale will significantly increase the surface energy of Ag particles and decrease the melting and sintering temperatures of AgNP paste. This will facilitate the sintering process at low temperatures but the sintered material is readily serving for high-temperature applications. Nevertheless, due to the limitation of prepared specimens and experimental equipment, it is challenging to evaluate the constitutive behaviour and mechanical properties of sintered AgNP material. In this study, a three-sided Berkovich diamond indenter with a tip radius of 50 nm is used to perform nanoindentation accompanied by the continuous stiffness measurement technique. Young's modulus and hardness are continuously measured with a function of penetration depth. By assuming a power-law for sintered AgNP to describe the plastic properties, the representative stress is calculated according to the indentation work done in the loading curve, and the work hardening exponent is calculated based on the contact stiffness in the unloading curve. Therefore, the stress-strain curve can be estimated from each indentation response despite the non-uniform morphology. By analyzing the stress-strain curves based on repeated indentation on the same material sample, reliable estimates regarding the constitutive behaviour of sintered AgNP can be made. Lastly, the limitations of the proposed approach are also addressed.

源语言英语
主期刊名Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
编辑Fei Xiao, Jun Wang, Lin Chen, Tianchun Ye
出版商Institute of Electrical and Electronics Engineers Inc.
466-471
页数6
ISBN(电子版)9781538663868
DOI
出版状态已出版 - 2 10月 2018
活动19th International Conference on Electronic Packaging Technology, ICEPT 2018 - Shanghai, 中国
期限: 8 8月 201811 8月 2018

出版系列

姓名Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018

会议

会议19th International Conference on Electronic Packaging Technology, ICEPT 2018
国家/地区中国
Shanghai
时期8/08/1811/08/18

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