Effects of the cooling rate on the solidification microstructure of Cu-Ni alloy

Jiawei Yuan, Yuhua Pang, Yanglei Hu, Qi Sun, Dong Liu, Yanhui Yang

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

The effect of cooling rate on the solidification microstructure of Cu-Ni alloy is investigated here. The Cu-Ni alloy was prepared in a main frequency furnace with three different molds made of silica sand, graphite, and low carbon steel in the foundry. The simulation software of diathermanous-flowing-stress coupling PROCAST is used to simulate the Cu-Ni alloy solidification process about temperature field with the three molds. The microstructures of the alloys have been studied through the optical microscopy (OM), the scanning electron microscopy (SEM), together with the energy dispersive spectroscopy (EDS).The results show that the grain average size and the primary and secondary dendrite arm space were obviously reduced with the increase of cooling rate. The dendrite and interdendrite element segregation also decreases with increasing cooling rate.

源语言英语
主期刊名Eco-Materials Processing and Design XI, ISEPD-11
出版商Trans Tech Publications Ltd
444-447
页数4
ISBN(印刷版)0878492445, 9780878492442
DOI
出版状态已出版 - 2010

出版系列

姓名Materials Science Forum
658
ISSN(印刷版)0255-5476
ISSN(电子版)1662-9752

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