Effect of Plasma Actuation on Impact, Dynamics, and Evaporation of Water Droplet on a Room-temperature Surface

Weiwei Hui, Zhipeng Chen, Mengzhuo Zhang, Xuanshi Meng, Haibao Hu, Huaxing Li

科研成果: 书/报告/会议事项章节会议稿件同行评审

2 引用 (Scopus)

摘要

The new concept of the anti-/de-icing method based on Alternative-Current high voltage-driven surface dielectric barrier discharge (AC-SDBD) plasma actuation has no complicated mechanical structure and potential aerodynamic loss, making it potential to be the anti-and de-icing methods used by next-generation aircraft. AC-SDBD plasma actuation will produce thermal, aerodynamic, chemical and electromagnetic effects, etc. Existing studies have shown that the coupling characteristics of aerodynamic and thermal effects are the main mechanisms of plasma icing control. To provide a deep mechanism description, the plasma actuation on the impact, dynamics, and evaporation characteristics of water droplets is of great significance and researched in the present paper. High-speed imaging technology and surface infrared temperature measurement were used to record the impact and post-impact process of water droplets on the surface of the plasma actuator. The impact, dynamics, and evaporation of the water droplet with plasma actuation during this process were studied. The experimental results show that the water droplet spreads over the covered electrode in a larger range with plasma actuation, and the maximum spreading coefficient increases in comparison with those of plasma-off. The plasma actuation has an obvious driving effect on the water droplet during the impact and post-impact process. The water droplet can be driven 5 mm downstream from the joint of the exposed and covered electrodes. With unsteady-on plasma actuation, the water droplet presents an obvious oscillate performance. All the break-up water droplets will completely evaporate within 50 seconds.

源语言英语
主期刊名AIAA AVIATION 2022 Forum
出版商American Institute of Aeronautics and Astronautics Inc, AIAA
ISBN(印刷版)9781624106354
DOI
出版状态已出版 - 2022
活动AIAA AVIATION 2022 Forum - Chicago, 美国
期限: 27 6月 20221 7月 2022

出版系列

姓名AIAA AVIATION 2022 Forum

会议

会议AIAA AVIATION 2022 Forum
国家/地区美国
Chicago
时期27/06/221/07/22

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