Effect of melt heat treatment on the solid/liquid interface morphology of directional solidification

Yingwen Cai, Guilin Zhang, Jinshan Li, Guang Chen, Hengzhi Fu

科研成果: 期刊稿件文章同行评审

5 引用 (Scopus)

摘要

A set of quadral-electrode DC input voltage measure equipment was built up to detect the electrical resistance of Sb-Bi single-phase alloy. The results suggest that Sb-5%wt Bi undergoes structural transition in the temperature range of 730-750°C. By overheating the melt to different temperatures and then cooling to 690°C after a period of time, the samples are directionally solidified in a Bridgeman-type furnace. It is found for the first time that after heat treatment of the melt, the solid/liquid interface morphology shows significant variation depending on the specific heat treatment. Also, in Ag-Cu, Al-Cu systems, bicrystal growth with different orientation is found to have different interface morphologies after heat treatment. It is believed that the evolution of the cluster size distribution in the melt contributes to these phenomena.

源语言英语
页(从-至)169-172
页数4
期刊Science and Technology of Advanced Materials
2
1
DOI
出版状态已出版 - 3月 2001

指纹

探究 'Effect of melt heat treatment on the solid/liquid interface morphology of directional solidification' 的科研主题。它们共同构成独一无二的指纹。

引用此