TY - GEN
T1 - Effect of electric current on constitutive behaviour and microstructure of SAC305 solder joint
AU - Tang, Wenbin
AU - Long, Xu
AU - Liu, Yongchao
AU - Du, Chongyang
AU - Yao, Yao
AU - Zhou, Cheng
AU - Wu, Yanpei
AU - Jia, Fengrui
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/12
Y1 - 2018/12
N2 - As the traditional lead-containing solders were banned for consumer electronics by RoHS laws, lead-free solders are widely adopted in the electronics packaging industry. The Sn-3.0Ag-0.5Cu (wt%, SAC305) solder material is one of the most commonly used die-attach solders. But the reliability of SAC305 solder joints under complex working conditions still requires to be carefully investigated. In this paper, the uniaxial tensile behavior of solder joint specimens with a diameter of 1.0 mm was investigated subjected to the strain rate of 10-4 s-1 under electric current density ranging from 1000 A/cm2 to 4000 A/cm2. In order to reveal the current stress effect under the mechanical-electrical coupled loadings, the uniaxial tensile properties of SAC305 solder joint specimens were measured by a multi-field loading system. In addition, the microstructure of the tensile specimens is observed by a scanning electron microscope. It was found that fracture mode changed from ductile fracture to the combination of brittle and ductile fracture when the current density raised from 1000A/cm2 to 2000A/cm2. And the fracture was more likely to happen near the interface when the current density is higher.
AB - As the traditional lead-containing solders were banned for consumer electronics by RoHS laws, lead-free solders are widely adopted in the electronics packaging industry. The Sn-3.0Ag-0.5Cu (wt%, SAC305) solder material is one of the most commonly used die-attach solders. But the reliability of SAC305 solder joints under complex working conditions still requires to be carefully investigated. In this paper, the uniaxial tensile behavior of solder joint specimens with a diameter of 1.0 mm was investigated subjected to the strain rate of 10-4 s-1 under electric current density ranging from 1000 A/cm2 to 4000 A/cm2. In order to reveal the current stress effect under the mechanical-electrical coupled loadings, the uniaxial tensile properties of SAC305 solder joint specimens were measured by a multi-field loading system. In addition, the microstructure of the tensile specimens is observed by a scanning electron microscope. It was found that fracture mode changed from ductile fracture to the combination of brittle and ductile fracture when the current density raised from 1000A/cm2 to 2000A/cm2. And the fracture was more likely to happen near the interface when the current density is higher.
UR - http://www.scopus.com/inward/record.url?scp=85064731733&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2018.8654268
DO - 10.1109/EPTC.2018.8654268
M3 - 会议稿件
AN - SCOPUS:85064731733
T3 - 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
SP - 717
EP - 721
BT - 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th IEEE Electronics Packaging Technology Conference, EPTC 2018
Y2 - 4 December 2018 through 7 December 2018
ER -