Effect of curing agent on properties of MG/PU/TDE-85 encapsulating materials

With methyl tetrahydrophthalic anhydride (MeTHPA) or methyl nadic anhydride (MNA) cured respectively and polyurethane modification of diglycidyl-4, 5-epoxycyclohexane-1, 2-dicarboxylate (TDE-85), two encapsulating materials of MG/PU/TDE-85/MeTHPA and MG/PU/TDE-85/MNA were prepared by the reinforcement of milled glass fiber (MG). The mechanical properties, thermal properties and electrical properties of two encapsulating materials were studied. The results indicate that two encapsulating materials both have good mechanical properties, thermal properties and electrical properties. The tensile strength, half decomposition temperature and volume resistance of MG/PU/TDE-85/MeTHPA encapsulating material are higher than MG/PU/TDE-85/MNA encapsulating material, but its impact strength, glass transition temperature are lower.