Dynamic mechanical model in grinding C/SiC composites

Menghua Zhang, Chenwei Shan, Ziwen Xia, Fangchao Jia, Ming Luo

科研成果: 期刊稿件文章同行评审

21 引用 (Scopus)

摘要

Grinding force is a crucial component which affects manufacturing processes, machining defects, and material removal rates. Currently, grinding force models for carbon fiber-reinforced silicon carbide matrix (C/SiC) composites are primarily based on the presumption of evenly distributed abrasive grains and indentation fracture mechanics. These modelling techniques ignore the microstructural characteristics for the material and only yield the average grinding force. Therefore, a dynamic grinding force model for C/SiC composites is presented in this study on the basis of the grinding wheel surface morphology, material microstructural characteristics, and brittle removal mode transition. First, the surface topography for the grinding wheel is simulated with a random offset algorithm, and the discriminative mechanisms of active grits in the grinding areas are revealed using a discrete grinding wheel and grit kinematic trajectories. Second, the removal mode of single active grit with different depths of cut on the cutting arc length is analyzed based on the material removal mechanisms (MRMs), and the corresponding cutting force model is presented through the establishment of a material microstructure feature model. Third, a dynamic grinding force model is presented based on the decomposition and summation of the active grit grinding forces in the grinding area. Experimental verification demonstrates that the model is able to precisely predict the detailed information, fluctuation amplitude, and distribution principle of the dynamic evolution in grinding force with fluctuation features. In addition, the model explores the surface morphology and machining defects generated during the grinding of C/SiC composites.

源语言英语
文章编号109042
期刊International Journal of Mechanical Sciences
268
DOI
出版状态已出版 - 15 4月 2024

指纹

探究 'Dynamic mechanical model in grinding C/SiC composites' 的科研主题。它们共同构成独一无二的指纹。

引用此