TY - JOUR
T1 - Diffusion welding of CoCrNi medium entropy alloy (MEA) and SUS 304 stainless steel at different bonding temperatures
AU - Samiuddin, Muhammad
AU - Li, Jinglong
AU - Chandio, Ali Dad
AU - Muzamil, Muhammad
AU - Siddiqui, Sumair Uddin
AU - Xiong, Jiangtao
N1 - Publisher Copyright:
© 2021, International Institute of Welding.
PY - 2021/11
Y1 - 2021/11
N2 - This research work was mainly concerned to investigate the effect of bonding temperature on the weldability of CoCrNi MEA with SUS 304 stainless steel. Shear test and nano hardness measurements were used to evaluate the mechanical performance of the welded joints. The formation of IMCs intensified along with the bond interface when samples were treated at low bonding temperature (i.e., 925 °C) which badly affected the joint’s shear strength. Reduction in IMCs formation transpired as the bonding temperature increase, and eventually, the formation of the solid solution was instigated at the bond interface. Furthermore, at 1075 °C bonding temperature, the bond interface was almost free from IMCs and transformed to a solid solution, triggering the enhancement of the joint’s shear strength. SEM with EDX, XRD, and thermal analysis was used for microstructural examination to comprehend the interface reaction/bond formation mechanism during the welding process. Moreover, a thermodynamic description is also provided to predict the phase formation at the bond interface. In this regard, established rules (i.e., ΔHmix, ΔSmix, Ω, and δ) to determine the phase stability of HEAs were implemented which found valid in predicting the phase formation at the bond interface.
AB - This research work was mainly concerned to investigate the effect of bonding temperature on the weldability of CoCrNi MEA with SUS 304 stainless steel. Shear test and nano hardness measurements were used to evaluate the mechanical performance of the welded joints. The formation of IMCs intensified along with the bond interface when samples were treated at low bonding temperature (i.e., 925 °C) which badly affected the joint’s shear strength. Reduction in IMCs formation transpired as the bonding temperature increase, and eventually, the formation of the solid solution was instigated at the bond interface. Furthermore, at 1075 °C bonding temperature, the bond interface was almost free from IMCs and transformed to a solid solution, triggering the enhancement of the joint’s shear strength. SEM with EDX, XRD, and thermal analysis was used for microstructural examination to comprehend the interface reaction/bond formation mechanism during the welding process. Moreover, a thermodynamic description is also provided to predict the phase formation at the bond interface. In this regard, established rules (i.e., ΔHmix, ΔSmix, Ω, and δ) to determine the phase stability of HEAs were implemented which found valid in predicting the phase formation at the bond interface.
KW - Bonding temperature
KW - CoCrNi medium entropy alloy (MEA)
KW - Diffusion welding
KW - Hardness
KW - Shear strength
KW - SUS 304 stainless steel
UR - http://www.scopus.com/inward/record.url?scp=85111635604&partnerID=8YFLogxK
U2 - 10.1007/s40194-021-01165-5
DO - 10.1007/s40194-021-01165-5
M3 - 文章
AN - SCOPUS:85111635604
SN - 0043-2288
VL - 65
SP - 2193
EP - 2206
JO - Welding in the World
JF - Welding in the World
IS - 11
ER -