TY - JOUR
T1 - Dielectric behavior associated with the synergetic microstructure and oxygen vacancies in CaCu3Ti4O12 ceramics
AU - Li, Zhuo
AU - Zhao, Peng
AU - Wang, Zhuo
AU - Xue, Xiaohui
AU - Li, Zongting
AU - Fan, Huiqing
N1 - Publisher Copyright:
© 2016, Springer Science+Business Media New York.
PY - 2016/7/1
Y1 - 2016/7/1
N2 - CaCu3Ti4O12 (CCTO) ceramics has been successfully fabricated by sol–gel processing. The microstructure of CCTO ceramics sintered at 1050 °C exhibits the inhomogeneity with the large grain in the order of several tens of micrometers separated by the nano-scale small grain in the grain boundary. And with the sintered temperatures increasing to 1075 °C, the small grain in the grain boundary gradually grows up, accompanied by the emergence of secondary phase CuxO. The temperature dependence of dielectric properties has been demonstrated that with the emergence of secondary phase, the dielectric constant for the ceramics sintered at 1075 °C is inferior to the one of the ceramics sintered at 1050 °C from room temperature to 250 °C. Defect model related to the contribution of the second ionized oxygen vacancies in the grain boundary are proposed, supported by the thermal activation theory.
AB - CaCu3Ti4O12 (CCTO) ceramics has been successfully fabricated by sol–gel processing. The microstructure of CCTO ceramics sintered at 1050 °C exhibits the inhomogeneity with the large grain in the order of several tens of micrometers separated by the nano-scale small grain in the grain boundary. And with the sintered temperatures increasing to 1075 °C, the small grain in the grain boundary gradually grows up, accompanied by the emergence of secondary phase CuxO. The temperature dependence of dielectric properties has been demonstrated that with the emergence of secondary phase, the dielectric constant for the ceramics sintered at 1075 °C is inferior to the one of the ceramics sintered at 1050 °C from room temperature to 250 °C. Defect model related to the contribution of the second ionized oxygen vacancies in the grain boundary are proposed, supported by the thermal activation theory.
UR - http://www.scopus.com/inward/record.url?scp=84961197375&partnerID=8YFLogxK
U2 - 10.1007/s10854-016-4702-3
DO - 10.1007/s10854-016-4702-3
M3 - 文章
AN - SCOPUS:84961197375
SN - 0957-4522
VL - 27
SP - 7327
EP - 7334
JO - Journal of Materials Science: Materials in Electronics
JF - Journal of Materials Science: Materials in Electronics
IS - 7
ER -