Cellular spacing selection of Cu-Mn alloy under ultrahigh temperature gradient and rapid solidification condition

S. Yang, Y. P. Su, Z. X. Liu, W. D. Huang, Y. H. Zhou

科研成果: 期刊稿件文章同行评审

摘要

Cellular spacing selection of Cu-27.3 wt pct Mn alloy has been investigated by laser surface rapid resolidification experiments. The experimental results show that there exists a wide distribution range in cellular spacing under ultra-high temperature gradient and rapid solidification conditions and the average spacing decreases with the increase of growth rate. The experimental results are compared with the current KGT model for rapid cellular/dendritic growth, and a reasonable agreement is found.

源语言英语
页(从-至)85-86
页数2
期刊Journal of Materials Science and Technology
17
1
出版状态已出版 - 1月 2001

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