Bonding properties of joining Si3N4/SiC ceramic by SiC adhesive

Dian Zhang; Yong Dong Xu; Li Tong Zhang; Lai Fei Cheng; Jun Qiang Ma; Chao Chen

Bonding properties of joining Si₃N₄/SiC ceramic by SiC adhesive

Dian Zhang, Yong Dong Xu, Li Tong Zhang, Lai Fei Cheng, Jun Qiang Ma, Chao Chen

材料学院

Northwestern Polytechnical University Xian

科研成果: 期刊稿件 › 文章 › 同行评审

摘要

A kind of adhesive, which was mainly composed of SiC, was used to join Si₃N₄/SiC ceramic pressurelessly. The results showed that the volume of the adhesive specimen is stable and have a little expansion when it was dried and sintered from room temperature to 1323K. The tensile strength was up to 1.76MPa when jointing at 1173K and holding 3 hours. The thermal shock residual strength remained 82% of its original strength. The joint zone was densified. The sintered adhesive and the parent material had similar microstructure and remarkable diffusion existed near the interface between them, which was beneficial to increase bonding strength and thermal shock resistance.

源语言	英语
页（从-至）	23-27+32
期刊	Cailiao Gongcheng/Journal of Materials Engineering
期	8
出版状态	已出版 - 8月 2006

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title = "Bonding properties of joining Si3N4/SiC ceramic by SiC adhesive",

abstract = "A kind of adhesive, which was mainly composed of SiC, was used to join Si3N4/SiC ceramic pressurelessly. The results showed that the volume of the adhesive specimen is stable and have a little expansion when it was dried and sintered from room temperature to 1323K. The tensile strength was up to 1.76MPa when jointing at 1173K and holding 3 hours. The thermal shock residual strength remained 82% of its original strength. The joint zone was densified. The sintered adhesive and the parent material had similar microstructure and remarkable diffusion existed near the interface between them, which was beneficial to increase bonding strength and thermal shock resistance.",

keywords = "Adhesive, Bonding strength, Joining, Silicon carbide",

author = "Dian Zhang and Xu, {Yong Dong} and Zhang, {Li Tong} and Cheng, {Lai Fei} and Ma, {Jun Qiang} and Chao Chen",

year = "2006",

month = aug,

language = "英语",

pages = "23--27+32",

journal = "Cailiao Gongcheng/Journal of Materials Engineering",

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TY - JOUR

T1 - Bonding properties of joining Si3N4/SiC ceramic by SiC adhesive

AU - Zhang, Dian

AU - Xu, Yong Dong

AU - Zhang, Li Tong

AU - Cheng, Lai Fei

AU - Ma, Jun Qiang

AU - Chen, Chao

PY - 2006/8

Y1 - 2006/8

N2 - A kind of adhesive, which was mainly composed of SiC, was used to join Si3N4/SiC ceramic pressurelessly. The results showed that the volume of the adhesive specimen is stable and have a little expansion when it was dried and sintered from room temperature to 1323K. The tensile strength was up to 1.76MPa when jointing at 1173K and holding 3 hours. The thermal shock residual strength remained 82% of its original strength. The joint zone was densified. The sintered adhesive and the parent material had similar microstructure and remarkable diffusion existed near the interface between them, which was beneficial to increase bonding strength and thermal shock resistance.

AB - A kind of adhesive, which was mainly composed of SiC, was used to join Si3N4/SiC ceramic pressurelessly. The results showed that the volume of the adhesive specimen is stable and have a little expansion when it was dried and sintered from room temperature to 1323K. The tensile strength was up to 1.76MPa when jointing at 1173K and holding 3 hours. The thermal shock residual strength remained 82% of its original strength. The joint zone was densified. The sintered adhesive and the parent material had similar microstructure and remarkable diffusion existed near the interface between them, which was beneficial to increase bonding strength and thermal shock resistance.

KW - Adhesive

KW - Bonding strength

KW - Joining

KW - Silicon carbide

UR - http://www.scopus.com/inward/record.url?scp=33750029032&partnerID=8YFLogxK

M3 - 文章

AN - SCOPUS:33750029032

SN - 1001-4381

SP - 23-27+32

JO - Cailiao Gongcheng/Journal of Materials Engineering

JF - Cailiao Gongcheng/Journal of Materials Engineering

IS - 8

ER -

Bonding properties of joining Si3N4/SiC ceramic by SiC adhesive

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Bonding properties of joining Si₃N₄/SiC ceramic by SiC adhesive