TY - JOUR
T1 - Analysis on formation of bad pixel cluster in IRFPA
AU - Wang, Wei
AU - Fan, Yangyu
AU - Si, Junjie
AU - Wu, Wei
AU - Hou, Zhijin
PY - 2012/11
Y1 - 2012/11
N2 - Bad pixel cluster in infrared focal plane array (IRFPA) increases difficulty and complexity of bad pixel correction algorithm. Meanwhile, software-based tracking and target recognition system are generally less tolerant of bad pixels, especially large bad pixel cluster, than a human user system. This reduces the amount of qualified IRFPAs. Statistical results of bad pixels were obtained through a lot of tests on IRFPA products. Single bad pixel, bad pixel pair and bad pixel cluster accounted for 60.8%, 17.6% and 21.6% of total bad pixels respectively. Causes of bad pixel cluster were confirmed through analysis and tests, which were material defects, pattern missing, indium residual, indium bump defects, non-contact pixels, crack and potential defects exposed in reliability tests. Screening test on detector material, better fabrication technology of indium bumps, low stress technical process and structure are important to reduce bad pixel cluster, which are conducive to improve the performance of IRFPA.
AB - Bad pixel cluster in infrared focal plane array (IRFPA) increases difficulty and complexity of bad pixel correction algorithm. Meanwhile, software-based tracking and target recognition system are generally less tolerant of bad pixels, especially large bad pixel cluster, than a human user system. This reduces the amount of qualified IRFPAs. Statistical results of bad pixels were obtained through a lot of tests on IRFPA products. Single bad pixel, bad pixel pair and bad pixel cluster accounted for 60.8%, 17.6% and 21.6% of total bad pixels respectively. Causes of bad pixel cluster were confirmed through analysis and tests, which were material defects, pattern missing, indium residual, indium bump defects, non-contact pixels, crack and potential defects exposed in reliability tests. Screening test on detector material, better fabrication technology of indium bumps, low stress technical process and structure are important to reduce bad pixel cluster, which are conducive to improve the performance of IRFPA.
KW - Bad pixel
KW - Bad pixel cluster
KW - Formation
KW - IRFPA
UR - http://www.scopus.com/inward/record.url?scp=84872577985&partnerID=8YFLogxK
M3 - 文章
AN - SCOPUS:84872577985
SN - 1007-2276
VL - 41
SP - 2857
EP - 2860
JO - Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering
JF - Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering
IS - 11
ER -