A NON-PARAMETRIC BAYESIAN MODEL FOR SUPPRESSING THE INTERFERENCE IN THE ACOUSTIC ARRAY MEASUREMENT

Liang Yu, Yongli Zhang, Mingsheng Lyu, Ran Wang, Yong Fang, Weikang Jiang

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Microphone array technology has a wide range of applications in areas such as mechanical noise source identification and aircraft noise source identification. The acoustic array is not only applied in anechoic chamber measurements, but also in in-situ measurements, which is an essential requirement for current applications. However, the microphone array measurements are inevitably affected by background interference when we wish to implement in-situ measurements. This paper proposes a general array denoising algorithm to address this issue. Considering the complexity of background interference, a Gaussian mixture model that can fit any probability distribution is constructed. The background interference tends to have non-independently and non-identically distributed characteristics between different microphone channels. The hierarchical Dirichlet process is applied to the Gaussian mixture model to avoid selecting the Gaussian component number. At the same time, a low-rank model of the sound source signal is constructed according to its correlation characteristics between microphones. All involved parameters of the proposed model are solved by the variational Bayesian inference. The sound source signal and the complex background interference are eventually separated. The performance of the proposed algorithm is evaluated in numerical simulation and laboratory experiments. Both the effectiveness and robustness of the proposed algorithm in suppressing the complex background interference are also verified.

源语言英语
主期刊名Proceedings of the 29th International Congress on Sound and Vibration, ICSV 2023
编辑Eleonora Carletti
出版商Society of Acoustics
ISBN(电子版)9788011034238
出版状态已出版 - 2023
已对外发布
活动29th International Congress on Sound and Vibration, ICSV 2023 - Prague, 捷克共和国
期限: 9 7月 202313 7月 2023

出版系列

姓名Proceedings of the International Congress on Sound and Vibration
ISSN(电子版)2329-3675

会议

会议29th International Congress on Sound and Vibration, ICSV 2023
国家/地区捷克共和国
Prague
时期9/07/2313/07/23

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