TY - JOUR
T1 - 液态聚碳硅烷的结构及固化行为对其陶瓷化的影响
AU - Yang, Miaomiao
AU - Ji, Tiezheng
AU - Zhao, Xiaoran
AU - Ma, Xutao
AU - Fan, Cunlong
AU - Li, Xueshuo
AU - Zhang, Yu
AU - Feng, Xiping
AU - Hou, Xiao
AU - Sha, Baolin
AU - Ma, Xiaoyan
N1 - Publisher Copyright:
© 2023 Chengdu University of Science and Technology. All rights reserved.
PY - 2023/5
Y1 - 2023/5
N2 - Liquid polycarbosilane, as a new precursor of ceramics, can be used to prepare ceramic matrix composites (CMC) by precursor infiltration and pyrolysis (PIP) process, and to improve the ablative resistance of flexible insulation layer by coating organic fibers. The structures of three liquid polycarbosilane precursors (VHPCS, VHPCs-S and AHPCS) were characterized by IR and NMR. The curing reaction before 150 ℃ was mainly carried out by various ways of C=C bond. Compared with the AHPCS, the mole ratio of double bond to hydrogen silicon bond in the VHPCS and VHPCS-S is increased by about 18.2%. The curing kinetics of three precursors in the system of dicumyl peroxide (DCP) was studied by non- isothermal DSC. The curing temperature and apparent activation energy of the precursors are decreased, and the precursors could achieve rapid crosslinking reaction at low temperature. The ceramization process of precursor and crystallization behavior of its pyrolysis products were analyzed by STA and XRD. The ceramic yield of VHPCS-S at 1200 ℃ is higher than that of the other two precursors (VHPCS and AHPCS). For the DCP/VHPCS-S crosslinking system, the ceramic yield reaches 89.82% after curing at 150 ℃. In addition, the addition of DCP can effectively inhibit β-SiC crystallization.
AB - Liquid polycarbosilane, as a new precursor of ceramics, can be used to prepare ceramic matrix composites (CMC) by precursor infiltration and pyrolysis (PIP) process, and to improve the ablative resistance of flexible insulation layer by coating organic fibers. The structures of three liquid polycarbosilane precursors (VHPCS, VHPCs-S and AHPCS) were characterized by IR and NMR. The curing reaction before 150 ℃ was mainly carried out by various ways of C=C bond. Compared with the AHPCS, the mole ratio of double bond to hydrogen silicon bond in the VHPCS and VHPCS-S is increased by about 18.2%. The curing kinetics of three precursors in the system of dicumyl peroxide (DCP) was studied by non- isothermal DSC. The curing temperature and apparent activation energy of the precursors are decreased, and the precursors could achieve rapid crosslinking reaction at low temperature. The ceramization process of precursor and crystallization behavior of its pyrolysis products were analyzed by STA and XRD. The ceramic yield of VHPCS-S at 1200 ℃ is higher than that of the other two precursors (VHPCS and AHPCS). For the DCP/VHPCS-S crosslinking system, the ceramic yield reaches 89.82% after curing at 150 ℃. In addition, the addition of DCP can effectively inhibit β-SiC crystallization.
KW - ceramic production rate
KW - crystallization behavior
KW - curing reaction kinetics
KW - liquid polycarbosilane
KW - SiC ceramics
UR - http://www.scopus.com/inward/record.url?scp=85171623194&partnerID=8YFLogxK
U2 - 10.16865/j.cnki.1000-7555.2023.0096
DO - 10.16865/j.cnki.1000-7555.2023.0096
M3 - 文章
AN - SCOPUS:85171623194
SN - 1000-7555
VL - 39
SP - 107
EP - 117
JO - Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering
JF - Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering
IS - 5
ER -