塑性变形连接工艺对 TC17 合金/TC4 合金连接界面组织与力学性能的影响

Li Xing Sun, Qi Jiang, Lian Li, Miao Quan Li

科研成果: 期刊稿件文章同行评审

摘要

TC17/TC4 bonds were fabricated by plastic deformation bonding, the microstructure and mechanical properties of TC17 alloy/TC4 alloy joint interface under different joining parameters were studied by means of metallographic microscope(OM), scanning electron microscope(SEM) and unidirectional shear tests, etc. Their internal relations were analyzed and the evolution mechanism of void structure was explored. The results show that the influence of bonding pressure and bonding temperature on the void evolution, bonding ratio and shear strength of TC17 alloy/TC4 alloy bonding interface is more significant. Due to the synergism of plastic flow and atomic diffusion of TC17 alloy/TC4 alloy bonding interface, the contact area of the interface increases and generates a large local strain at the interface. The voids change from short rod shape to oval shape and then to round shape, which gradually decrease until disappear. As a result, the bonding ratio improves and the shear strength increases.

投稿的翻译标题Effect of plastic deformation bonding process on microstructure and mechanical properties of TC17 alloy/TC4 alloy interface
源语言繁体中文
页(从-至)3229-3238
页数10
期刊Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals
33
10
DOI
出版状态已出版 - 10月 2023

关键词

  • interface bonding ratio
  • plastic deformation bonding
  • shear strength
  • TC17 alloy/TC4 alloy
  • void

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