Twinning-assisted void initiation and crack evolution in Cu thin film: An in situ TEM and molecular dynamics study

Zongde Kou; Yanqing Yang; Lixia Yang; Bin Huang; Xian Luo

doi:10.1016/j.msea.2018.09.069

Twinning-assisted void initiation and crack evolution in Cu thin film: An in situ TEM and molecular dynamics study

Zongde Kou, Yanqing Yang, Lixia Yang, Bin Huang, Xian Luo

School of Materials Sience and Engineering

Research output: Contribution to journal › Article › peer-review

15 Scopus citations

Abstract

A twinning-induced void initiation mechanism at grain boundary is revealed in Cu through in situ tensile tests. Two microcracks connected by a twin boundary (TB) are formed following the growth of the void, which then develop via the relative sliding of the two crystals beside the migrating TB. The experimental observations of TB migration and dislocation activities are corroborated by performing molecular dynamics simulations.

Original language	English
Pages (from-to)	336-340
Number of pages	5
Journal	Materials Science and Engineering: A
Volume	737
DOIs	https://doi.org/10.1016/j.msea.2018.09.069
State	Published - 8 Nov 2018

Keywords

Cracking
Cu
In situ TEM
Molecular dynamics simulations
Twinning

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10.1016/j.msea.2018.09.069

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@article{ee2caa7169b5421abdb861b1299c8d88,

title = "Twinning-assisted void initiation and crack evolution in Cu thin film: An in situ TEM and molecular dynamics study",

abstract = "A twinning-induced void initiation mechanism at grain boundary is revealed in Cu through in situ tensile tests. Two microcracks connected by a twin boundary (TB) are formed following the growth of the void, which then develop via the relative sliding of the two crystals beside the migrating TB. The experimental observations of TB migration and dislocation activities are corroborated by performing molecular dynamics simulations.",

keywords = "Cracking, Cu, In situ TEM, Molecular dynamics simulations, Twinning",

author = "Zongde Kou and Yanqing Yang and Lixia Yang and Bin Huang and Xian Luo",

note = "Publisher Copyright: {\textcopyright} 2018 Elsevier B.V.",

year = "2018",

month = nov,

day = "8",

doi = "10.1016/j.msea.2018.09.069",

language = "英语",

volume = "737",

pages = "336--340",

journal = "Materials Science and Engineering: A",

issn = "0921-5093",

publisher = "Elsevier Ltd",

}

TY - JOUR

T1 - Twinning-assisted void initiation and crack evolution in Cu thin film

T2 - An in situ TEM and molecular dynamics study

AU - Kou, Zongde

AU - Yang, Yanqing

AU - Yang, Lixia

AU - Huang, Bin

AU - Luo, Xian

PY - 2018/11/8

Y1 - 2018/11/8

N2 - A twinning-induced void initiation mechanism at grain boundary is revealed in Cu through in situ tensile tests. Two microcracks connected by a twin boundary (TB) are formed following the growth of the void, which then develop via the relative sliding of the two crystals beside the migrating TB. The experimental observations of TB migration and dislocation activities are corroborated by performing molecular dynamics simulations.

AB - A twinning-induced void initiation mechanism at grain boundary is revealed in Cu through in situ tensile tests. Two microcracks connected by a twin boundary (TB) are formed following the growth of the void, which then develop via the relative sliding of the two crystals beside the migrating TB. The experimental observations of TB migration and dislocation activities are corroborated by performing molecular dynamics simulations.

KW - Cracking

KW - Cu

KW - In situ TEM

KW - Molecular dynamics simulations

KW - Twinning

UR - http://www.scopus.com/inward/record.url?scp=85053855247&partnerID=8YFLogxK

U2 - 10.1016/j.msea.2018.09.069

DO - 10.1016/j.msea.2018.09.069

M3 - 文章

AN - SCOPUS:85053855247

SN - 0921-5093

VL - 737

SP - 336

EP - 340

JO - Materials Science and Engineering: A

JF - Materials Science and Engineering: A

ER -

Twinning-assisted void initiation and crack evolution in Cu thin film: An in situ TEM and molecular dynamics study

Abstract

Keywords

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