Three-dimensional micro-pipelines high thermal conductive C/SiC composites

Yunhai Zhang, Yongsheng Liu, Liyang Cao, Hui Fang, Bin Liu, Yejie Cao, Jing Wang, Jian Chen, Yu Pan

Research output: Contribution to journalArticlepeer-review

12 Scopus citations

Abstract

Carbon/silicon carbide (C/SiC) composites are usually regarded as thermal protective system materials and widely applied in hypersonic vehicles or ramjet. However, poor thermal conductivity of C/SiC composites, leading to severe heat concentration and thermal stress during the high-speed operation of hypersonic vehicle, limits their broad-range of practical applications. Modification with high thermal conductive fillers is an optional method; however, controllable dispersion and orientation of the fillers to construct continuous and ordered heat conductive channel has been proven to be a challenging task. Herein, based on high thermal conductivity fibers, a three-dimensional micro-pipeline preform was developed for the preparation of structure–function integrated C/SiC composites. The technical feasibility of the method, the characteristics of microstructures, and the thermal conductivity and bending strength of the as-obtained composites were systematically studied. Results revealed that the thermal conductivities of as-obtained composites reached 150.2 and 46.7 W m−1 K−1 for in-plane and out-of-plane direction, respectively. The bending strength obtained herein is 264.4 MPa, which is lower than that of polyacrylonitrile C/SiC composites. However, the fine control over the component and microstructure or densification could provide a higher value in the future research. In sum, the proposed method provides a convenient and feasible approach to prepare high thermal conductive C/SiC composites.

Original languageEnglish
Pages (from-to)34333-34340
Number of pages8
JournalCeramics International
Volume47
Issue number24
DOIs
StatePublished - 15 Dec 2021

Keywords

  • Bending strength
  • C/SiC composites
  • Heat conductive channels
  • Micro-pipelines
  • Thermal conductivity

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