Thermal, mechanical and dielectric properties of silicon carbide/polyphenylene sulfide composites

Jun Wei Gu, Jun Jun Feng, Jing Dang, Hai Lin Li, Qiu Yu Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

The functionalized silicon carbide (SiC) fillers are employed to fabricate silicon carbide/polyphenylene sulfide (PPS) composites by mechanical ball milling-compression molding method. The thermal conductive coefficient of the SiC/PPS composites with 40 wt% functionalized SiC is 0.934 W/ mK, 4 times higher than that of the original PPS. The mechanical properties of SiC/PPS composites are optimal with 5 wt% addition of SiC. Both the heat resistant and dielectric properties of the SiC/PPS composites are increased with the increasing addition of SiC. For a given SiC loading, the surface functionalization of SiC can improve the thermal conductivities and mechanical properties of the SiC/PPS composites simultaneously.

Original languageEnglish
Title of host publicationAdvanced Materials and Engineering Materials III
PublisherTrans Tech Publications
Pages209-212
Number of pages4
ISBN (Print)9783038350255
DOIs
StatePublished - 2014
Event2013 3rd International Conference on Advanced Materials and Engineering Materials 2013, CAMEM 2013 - , Singapore
Duration: 14 Dec 201315 Dec 2013

Publication series

NameAdvanced Materials Research
Volume893
ISSN (Print)1022-6680

Conference

Conference2013 3rd International Conference on Advanced Materials and Engineering Materials 2013, CAMEM 2013
Country/TerritorySingapore
Period14/12/1315/12/13

Keywords

  • Dielectric constant
  • Polyphenylene sulfide
  • Silicon carbide
  • Thermal conductivities

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