@inproceedings{fce23761617c468c91d19d402b49d912,
title = "Thermal, mechanical and dielectric properties of silicon carbide/polyphenylene sulfide composites",
abstract = "The functionalized silicon carbide (SiC) fillers are employed to fabricate silicon carbide/polyphenylene sulfide (PPS) composites by mechanical ball milling-compression molding method. The thermal conductive coefficient of the SiC/PPS composites with 40 wt% functionalized SiC is 0.934 W/ mK, 4 times higher than that of the original PPS. The mechanical properties of SiC/PPS composites are optimal with 5 wt% addition of SiC. Both the heat resistant and dielectric properties of the SiC/PPS composites are increased with the increasing addition of SiC. For a given SiC loading, the surface functionalization of SiC can improve the thermal conductivities and mechanical properties of the SiC/PPS composites simultaneously.",
keywords = "Dielectric constant, Polyphenylene sulfide, Silicon carbide, Thermal conductivities",
author = "Gu, {Jun Wei} and Feng, {Jun Jun} and Jing Dang and Li, {Hai Lin} and Zhang, {Qiu Yu}",
year = "2014",
doi = "10.4028/www.scientific.net/AMR.893.209",
language = "英语",
isbn = "9783038350255",
series = "Advanced Materials Research",
publisher = "Trans Tech Publications",
pages = "209--212",
booktitle = "Advanced Materials and Engineering Materials III",
note = "2013 3rd International Conference on Advanced Materials and Engineering Materials 2013, CAMEM 2013 ; Conference date: 14-12-2013 Through 15-12-2013",
}