Ternary eutectic growth during directional solidification of Ag-Cu-Sb alloy

Wei Zhai; Baojian Wang; Liang Hu; Bingbo Wei

doi:10.1080/09500839.2015.1010621

Ternary eutectic growth during directional solidification of Ag-Cu-Sb alloy

Wei Zhai, Baojian Wang, Liang Hu, Bingbo Wei

School of Physical Science and Technology

Northwestern Polytechnical University Xian

Research output: Contribution to journal › Article › peer-review

6 Scopus citations

Abstract

The directional solidification process of ternary Ag_42.4Cu_21.6Sb₃₆ eutectic alloy within a wide growth rate range from 2 to 60 μm/s was accomplished at a constant temperature gradient of 50 K/cm. As growth rate increases, the ternary (θ(Cu₂Sb) + ε(Ag₃Sb) + Sb) eutectic morphology evolves from "lamellar (θ + ε) plus fibrous (Sb)" structure into "(θ + Sb) fibres in continuous ε matrix" structure. The θ and (Sb) phase spacings decrease with the increase of growth rate according to power functions with exponent values of 0.55 and 0.56, respectively. It is also found that the microhardness of directionally solidified Ag_42.4Cu_21.6Sb₃₆ alloy samples is enhanced with the increase of growth rate, and the decrease of θ and (Sb) phase spacings.

Original language	English
Pages (from-to)	187-193
Number of pages	7
Journal	Philosophical Magazine Letters
Volume	95
Issue number	4
DOIs	https://doi.org/10.1080/09500839.2015.1010621
State	Published - 3 Apr 2015

Keywords

microhardness
microstructure
phase transformation
solidification
ternary eutectic growth

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10.1080/09500839.2015.1010621

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@article{1f913a94718043fb883d2d8b93d76d77,

title = "Ternary eutectic growth during directional solidification of Ag-Cu-Sb alloy",

abstract = "The directional solidification process of ternary Ag42.4Cu21.6Sb36 eutectic alloy within a wide growth rate range from 2 to 60 μm/s was accomplished at a constant temperature gradient of 50 K/cm. As growth rate increases, the ternary (θ(Cu2Sb) + ε(Ag3Sb) + Sb) eutectic morphology evolves from {"}lamellar (θ + ε) plus fibrous (Sb){"} structure into {"}(θ + Sb) fibres in continuous ε matrix{"} structure. The θ and (Sb) phase spacings decrease with the increase of growth rate according to power functions with exponent values of 0.55 and 0.56, respectively. It is also found that the microhardness of directionally solidified Ag42.4Cu21.6Sb36 alloy samples is enhanced with the increase of growth rate, and the decrease of θ and (Sb) phase spacings.",

keywords = "microhardness, microstructure, phase transformation, solidification, ternary eutectic growth",

author = "Wei Zhai and Baojian Wang and Liang Hu and Bingbo Wei",

note = "Publisher Copyright: {\textcopyright} 2015 Taylor & Francis.",

year = "2015",

month = apr,

day = "3",

doi = "10.1080/09500839.2015.1010621",

language = "英语",

volume = "95",

pages = "187--193",

journal = "Philosophical Magazine Letters",

issn = "0950-0839",

publisher = "Taylor and Francis Ltd.",

number = "4",

}

TY - JOUR

T1 - Ternary eutectic growth during directional solidification of Ag-Cu-Sb alloy

AU - Zhai, Wei

AU - Wang, Baojian

AU - Hu, Liang

AU - Wei, Bingbo

PY - 2015/4/3

Y1 - 2015/4/3

N2 - The directional solidification process of ternary Ag42.4Cu21.6Sb36 eutectic alloy within a wide growth rate range from 2 to 60 μm/s was accomplished at a constant temperature gradient of 50 K/cm. As growth rate increases, the ternary (θ(Cu2Sb) + ε(Ag3Sb) + Sb) eutectic morphology evolves from "lamellar (θ + ε) plus fibrous (Sb)" structure into "(θ + Sb) fibres in continuous ε matrix" structure. The θ and (Sb) phase spacings decrease with the increase of growth rate according to power functions with exponent values of 0.55 and 0.56, respectively. It is also found that the microhardness of directionally solidified Ag42.4Cu21.6Sb36 alloy samples is enhanced with the increase of growth rate, and the decrease of θ and (Sb) phase spacings.

AB - The directional solidification process of ternary Ag42.4Cu21.6Sb36 eutectic alloy within a wide growth rate range from 2 to 60 μm/s was accomplished at a constant temperature gradient of 50 K/cm. As growth rate increases, the ternary (θ(Cu2Sb) + ε(Ag3Sb) + Sb) eutectic morphology evolves from "lamellar (θ + ε) plus fibrous (Sb)" structure into "(θ + Sb) fibres in continuous ε matrix" structure. The θ and (Sb) phase spacings decrease with the increase of growth rate according to power functions with exponent values of 0.55 and 0.56, respectively. It is also found that the microhardness of directionally solidified Ag42.4Cu21.6Sb36 alloy samples is enhanced with the increase of growth rate, and the decrease of θ and (Sb) phase spacings.

KW - microhardness

KW - microstructure

KW - phase transformation

KW - solidification

KW - ternary eutectic growth

UR - http://www.scopus.com/inward/record.url?scp=84938418373&partnerID=8YFLogxK

U2 - 10.1080/09500839.2015.1010621

DO - 10.1080/09500839.2015.1010621

M3 - 文章

AN - SCOPUS:84938418373

SN - 0950-0839

VL - 95

SP - 187

EP - 193

JO - Philosophical Magazine Letters

JF - Philosophical Magazine Letters

IS - 4

ER -

Ternary eutectic growth during directional solidification of Ag-Cu-Sb alloy

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Keywords

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