@inproceedings{35c672bb8c774deca71fa706de9440cb,
title = "Substrate-free patch antenna array realized by metallic 3-D printing",
abstract = "A substrate-free low profile patch antenna array is the subject of discussion in this paper. The objective is to transform the traditional microstrip antennas whose metallic circuit lines and patches are etched on Printed Circuit Boards (PCB), whereas the proposed structure does not have the need for PCB while retaining all the good features of patch antenna array. This effectively gets rid of any dielectric loss, aiding to achieve higher efficiency and consequently higher gain. A 3-D printing technique is adopted in this work to realize this unique structure. Results show that the substrate-free patch antenna array can operate with a bandwidth of about 35%. Gain is better than 12dBi in the entire band and a 15dBi gain is achieved at the center frequency.",
keywords = "3-D printing, antenna array, patch antenna, Substrate-free",
author = "Chio, {Tan Huat} and Huang, {Guan Long} and Zhou, {Shi Gang}",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 5th IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2016 ; Conference date: 26-07-2016 Through 29-07-2016",
year = "2017",
month = feb,
day = "3",
doi = "10.1109/APCAP.2016.7843091",
language = "英语",
series = "APCAP 2016 - 2016 IEEE 5th Asia-Pacific Conference on Antennas and Propagation, Conference Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "45--46",
booktitle = "APCAP 2016 - 2016 IEEE 5th Asia-Pacific Conference on Antennas and Propagation, Conference Proceedings",
}