Substrate-free patch antenna array realized by metallic 3-D printing

Tan Huat Chio, Guan Long Huang, Shi Gang Zhou

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A substrate-free low profile patch antenna array is the subject of discussion in this paper. The objective is to transform the traditional microstrip antennas whose metallic circuit lines and patches are etched on Printed Circuit Boards (PCB), whereas the proposed structure does not have the need for PCB while retaining all the good features of patch antenna array. This effectively gets rid of any dielectric loss, aiding to achieve higher efficiency and consequently higher gain. A 3-D printing technique is adopted in this work to realize this unique structure. Results show that the substrate-free patch antenna array can operate with a bandwidth of about 35%. Gain is better than 12dBi in the entire band and a 15dBi gain is achieved at the center frequency.

Original languageEnglish
Title of host publicationAPCAP 2016 - 2016 IEEE 5th Asia-Pacific Conference on Antennas and Propagation, Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages45-46
Number of pages2
ISBN (Electronic)9781467372374
DOIs
StatePublished - 3 Feb 2017
Event5th IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2016 - Kaohsiung, Taiwan, Province of China
Duration: 26 Jul 201629 Jul 2016

Publication series

NameAPCAP 2016 - 2016 IEEE 5th Asia-Pacific Conference on Antennas and Propagation, Conference Proceedings

Conference

Conference5th IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2016
Country/TerritoryTaiwan, Province of China
CityKaohsiung
Period26/07/1629/07/16

Keywords

  • 3-D printing
  • antenna array
  • patch antenna
  • Substrate-free

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