@inproceedings{ced9aa19d3564714bf826e83db2209d2,
title = "Study on low silver Sn-Ag-Cu-P alloy for wave soldering",
abstract = "In recent years, it's a tendency that many researchers are focusing on low Ag lead-free solder due to high cost of silver. However, it's inevitable that the oxidation may arise because of higher content of tin, especially in wave soldering. In this study, the melting point, hardness, microstructure, wettability and anti-oxidation property of Sn-0.3Ag-0.7Cu-0.004P solder (SACP) were researched and compared with those of Sn-0.3Ag-0.7Cu (SAC). SACP had better oxidation resistance and poorer wettability than SAC, and their melting characteristics were similar.",
keywords = "lead-free solder, low Ag, P, Sn-0.3Ag-0.7Cu",
author = "Junjie Wang and Xicheng Wei and Wenqi Zhu and Jian Wu and Nianzu Wu",
year = "2013",
doi = "10.1109/IPFA.2013.6599206",
language = "英语",
isbn = "9781479912414",
series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",
pages = "485--489",
booktitle = "Proceedings of the 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2013",
note = "2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2013 ; Conference date: 15-07-2013 Through 19-07-2013",
}