Study on chemical polishing of CdZnTe wafer surface

Xiao Qin Wang, Wan Qi Jie, Ge Yang

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Different concentrations of Br2-MeOH were used for the chemical polishing of CdZnTe(CZT) surface. It was found that the CZT wafer in 2% Br2-MeOH had a stationary erosion rate and could be easily controlled. The surface scratches were removed and a shiny surface was obtained. Through AFM analysis, it was proved that the chemical polishing could reduce the surface roughness about 30%. XPS analysis found that the (111) Cd polar face became the nonpolar Te rich surface after the chemical polishing. PL analysis showed that the chemical polishing could reduce the surface trap state density and improve the perfection of surface lattice.

Original languageEnglish
Pages (from-to)790-793+804
JournalRengong Jingti Xuebao/Journal of Synthetic Crystals
Volume34
Issue number5
StatePublished - Oct 2005

Keywords

  • CdZnTe
  • Chemical polishing
  • Defect
  • Erosion rate
  • Mean roughness
  • Surface composition

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