TY - JOUR
T1 - Study of oxygen diffusion and oxidation of silver alloys for Bi-2223 and their effect on tape fabrication
AU - Liu, Xueqian
AU - Zhou, Zesheng
AU - Li, Jianfeng
AU - Zhang, Shengnan
AU - Li, Heng
AU - Yang, Yanfeng
AU - Jin, Lihua
AU - Hao, Qingbin
AU - Feng, Jian Qing
AU - Li, Chengshan
AU - Zhang, Pingxiang
N1 - Publisher Copyright:
© The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2025.
PY - 2025/2
Y1 - 2025/2
N2 - Silver and silver alloys are essential sheathing materials for Bi2Sr2Ca2Cu3O10+δ (Bi-2223) superconducting tapes, due to their oxygen permeability, workability, and chemical compatibility with the highly reactive Bi-2223 powder. Alloying elements can enhance material strength, but oxidation triggered by oxygen diffusion during fabrication process affects their chemical and mechanical properties. This study investigates the oxygen diffusion and internal oxidation behavior of AgMg, AgMgNi, and AgMn alloys, which are commonly used as sheathing materials for Bi-2223 tapes. The oxygen diffusion kinetics of these alloys were analyzed under various temperatures and oxygen partial pressures to determine their diffusion rates and their effects on microstructure. The results indicate that AgMg-based alloys exhibit higher oxidation rates than AgMn, primarily due to the reactivity of Mg, which leads to significant mechanical strengthening but reduced ductility after complete oxidation. Oxidant precipitates observed at grain boundaries was found to influence the tensile behavior of the alloys. Moreover, Bi-2223 tapes fabricated with AgMg-based sheaths exhibited notable surface defects and reduced plasticity, particularly after heat treatment and intermediate rolling processes, attributed to the formation of MgO and CuO precipitates, which also altered the Cu content within the filament during heat treatment. These findings suggest that while AgMg-based alloys offer mechanical advantages, their oxidation characteristics may pose challenges in maintaining tape integrity during fabrication. It is essential to further optimize alloy compositions and processing conditions to achieve the best possible performance in superconducting tapes.
AB - Silver and silver alloys are essential sheathing materials for Bi2Sr2Ca2Cu3O10+δ (Bi-2223) superconducting tapes, due to their oxygen permeability, workability, and chemical compatibility with the highly reactive Bi-2223 powder. Alloying elements can enhance material strength, but oxidation triggered by oxygen diffusion during fabrication process affects their chemical and mechanical properties. This study investigates the oxygen diffusion and internal oxidation behavior of AgMg, AgMgNi, and AgMn alloys, which are commonly used as sheathing materials for Bi-2223 tapes. The oxygen diffusion kinetics of these alloys were analyzed under various temperatures and oxygen partial pressures to determine their diffusion rates and their effects on microstructure. The results indicate that AgMg-based alloys exhibit higher oxidation rates than AgMn, primarily due to the reactivity of Mg, which leads to significant mechanical strengthening but reduced ductility after complete oxidation. Oxidant precipitates observed at grain boundaries was found to influence the tensile behavior of the alloys. Moreover, Bi-2223 tapes fabricated with AgMg-based sheaths exhibited notable surface defects and reduced plasticity, particularly after heat treatment and intermediate rolling processes, attributed to the formation of MgO and CuO precipitates, which also altered the Cu content within the filament during heat treatment. These findings suggest that while AgMg-based alloys offer mechanical advantages, their oxidation characteristics may pose challenges in maintaining tape integrity during fabrication. It is essential to further optimize alloy compositions and processing conditions to achieve the best possible performance in superconducting tapes.
UR - http://www.scopus.com/inward/record.url?scp=85218198607&partnerID=8YFLogxK
U2 - 10.1007/s10854-025-14336-7
DO - 10.1007/s10854-025-14336-7
M3 - 文章
AN - SCOPUS:85218198607
SN - 0957-4522
VL - 36
JO - Journal of Materials Science: Materials in Electronics
JF - Journal of Materials Science: Materials in Electronics
IS - 4
M1 - 259
ER -