Simulation of the interface characterization of thin film on substrate system by bending creep tests

S. F. Wen, W. Z. Yan, J. X. Kang, J. Liu, Z. F. Yue

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

In the present paper, the finite element simulation of the bending creep tests of the thin film on substrate system is carried out. The purpose of the investigation is to understand the creep stress characterization of the thin film on substrate system with the three points bending creep test method, which plays an important role in the bending creep testing characterization, so as to provide some foundation on determination of interface properties of the thin film on substrate system by a bending creep testing. Finite element results shows that the influences of the thickness of thin film and the modulus ratio of thin film to substrate on stress distribution are important.

Original languageEnglish
Pages (from-to)1289-1294
Number of pages6
JournalApplied Surface Science
Volume257
Issue number4
DOIs
StatePublished - 1 Dec 2010

Keywords

  • Bending creep testing
  • Finite element method
  • Interface
  • Thin film on substrate system

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