Sandwich Structured Flexible Thermal Shear Stress Sensor with Improved Performance

Baoyun Sun, Wei Gao, Pengbin Wang, Runbo Chen, Jian Luo, Jinjun Deng, Weizheng Yuan, Binghe Ma

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

We present a micro flexible thermal shear stress sensor with sandwich structure for enhanced static sensitivity and dynamic response performance. This sandwich structure consists of a guard-heater just underneath the thermistor and electrically isolated by a Parylene C film. The working temperature of the guard-heater is identical with the thermistor to eliminate unwanted heat conduction from the thermistor to the substrate. Compared with thermistor working individually, the results of shear stress calibration test and step current characterization demonstrate a 47% increase in sensitivity and 50% reduction in time constant when the thermistor and guard-heater working simultaneously.

Original languageEnglish
Title of host publication33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages653-656
Number of pages4
ISBN (Electronic)9781728135809
DOIs
StatePublished - Jan 2020
Event33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020 - Vancouver, Canada
Duration: 18 Jan 202022 Jan 2020

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2020-January
ISSN (Print)1084-6999

Conference

Conference33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
Country/TerritoryCanada
CityVancouver
Period18/01/2022/01/20

Keywords

  • Flexible thermal sensor
  • sandwich structure
  • sensitivity
  • shear stress
  • time constant

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