Research on model based reliability system engineering methodology of system in package

Yutai Su; Guicui Fu; Ye Wang; Hongyan Leng; Hantian Gu

doi:10.1109/EDAPS.2017.8277030

Research on model based reliability system engineering methodology of system in package

Yutai Su, Guicui Fu, Ye Wang, Hongyan Leng, Hantian Gu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

With the rapid development of SiP technology, reliability problems on the SiP can not be resolved by single theories and traditional methods. This paper proposed a MBRSE methodology of SiP, describing requirement analysis, design, manufacturing, test and product acceptance of SiP. Some reliability models of SiP were provided as references, including data-driven models and PoF models. Finally, some directions for MBRSE of SiP were recommended to be researched.

Original language	English
Title of host publication	2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1-3
Number of pages	3
ISBN (Electronic)	9781538612385
DOIs	https://doi.org/10.1109/EDAPS.2017.8277030
State	Published - 2 Jul 2017
Externally published	Yes
Event	2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 - Haining, Zhejiang, China Duration: 14 Dec 2017 → 16 Dec 2017

Publication series

Name	2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
Volume	2018-January

Conference

Conference	2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
Country/Territory	China
City	Haining, Zhejiang
Period	14/12/17 → 16/12/17

Keywords

Model Based Reliability System Engineering
Reliability Models
System in Package

Access to Document

10.1109/EDAPS.2017.8277030

Cite this

Su, Y., Fu, G., Wang, Y., Leng, H., & Gu, H. (2017). Research on model based reliability system engineering methodology of system in package. In 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 (pp. 1-3). (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017; Vol. 2018-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDAPS.2017.8277030

Su, Yutai ; Fu, Guicui ; Wang, Ye et al. / Research on model based reliability system engineering methodology of system in package. 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1-3 (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017).

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title = "Research on model based reliability system engineering methodology of system in package",

abstract = "With the rapid development of SiP technology, reliability problems on the SiP can not be resolved by single theories and traditional methods. This paper proposed a MBRSE methodology of SiP, describing requirement analysis, design, manufacturing, test and product acceptance of SiP. Some reliability models of SiP were provided as references, including data-driven models and PoF models. Finally, some directions for MBRSE of SiP were recommended to be researched.",

keywords = "Model Based Reliability System Engineering, Reliability Models, System in Package",

author = "Yutai Su and Guicui Fu and Ye Wang and Hongyan Leng and Hantian Gu",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 ; Conference date: 14-12-2017 Through 16-12-2017",

year = "2017",

month = jul,

day = "2",

doi = "10.1109/EDAPS.2017.8277030",

language = "英语",

series = "2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1--3",

booktitle = "2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017",

}

Su, Y, Fu, G, Wang, Y, Leng, H & Gu, H 2017, Research on model based reliability system engineering methodology of system in package. in 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017, vol. 2018-January, Institute of Electrical and Electronics Engineers Inc., pp. 1-3, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017, Haining, Zhejiang, China, 14/12/17. https://doi.org/10.1109/EDAPS.2017.8277030

Research on model based reliability system engineering methodology of system in package. / Su, Yutai; Fu, Guicui; Wang, Ye et al.
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1-3 (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017; Vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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N2 - With the rapid development of SiP technology, reliability problems on the SiP can not be resolved by single theories and traditional methods. This paper proposed a MBRSE methodology of SiP, describing requirement analysis, design, manufacturing, test and product acceptance of SiP. Some reliability models of SiP were provided as references, including data-driven models and PoF models. Finally, some directions for MBRSE of SiP were recommended to be researched.

AB - With the rapid development of SiP technology, reliability problems on the SiP can not be resolved by single theories and traditional methods. This paper proposed a MBRSE methodology of SiP, describing requirement analysis, design, manufacturing, test and product acceptance of SiP. Some reliability models of SiP were provided as references, including data-driven models and PoF models. Finally, some directions for MBRSE of SiP were recommended to be researched.

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KW - Reliability Models

KW - System in Package

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M3 - 会议稿件

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PB - Institute of Electrical and Electronics Engineers Inc.

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ER -

Su Y, Fu G, Wang Y, Leng H, Gu H. Research on model based reliability system engineering methodology of system in package. In 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1-3. (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017). doi: 10.1109/EDAPS.2017.8277030

Research on model based reliability system engineering methodology of system in package

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