PTLP bonding C/C composites to super-alloy GH3044 with Ni/Ti interlayer

Shu Mei Zhang, Ke Zhi Li, Jie Wang, Xin Rui Song, Ling Jun Guo

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Abstract

C/C composites can be jointed to super-alloy GH3044 with Ni/Ti interlayer by partial transient liquid-phase (PTLP) bonding under vacuum. Microstructures and element distribution were characterized by SEM and EDS. Interfacial structure of Ni/GH3044 diffusion layer + residual Ni layer + Ni-Ti intermetalics + reaction layer was formed under experimental conditions. With the increase of holding time, Ni 3Ti intermetalic layer between NiTi and Ni gradually grew, while NiTi and Ni were consumed. However, large-size cracks were observed near the C/C composite/interlyer interface, resulting in unsatisfactory performance of obtained joints, with the shear strength of only 9.78 MPa.

Original languageEnglish
Pages (from-to)414-418
Number of pages5
JournalGuti Huojian Jishu/Journal of Solid Rocket Technology
Volume35
Issue number3
StatePublished - Jun 2012

Keywords

  • C/C composites
  • Formation mechanism
  • GH3044
  • PTLP bonding
  • Thermal stress

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