TY - GEN
T1 - Preparation and properties of rigid cross-linked PVC foam
AU - Shi, Aihua
AU - Zhang, Guangcheng
AU - Pan, Hengtai
AU - Ma, Zhonglei
AU - Zhao, Chenhui
PY - 2011
Y1 - 2011
N2 - High performance rigid cross-linked PVC foam has been prepared by molding process and boiling foam process with the main materials including polyvinyl chloride paste resin (PVC), liquefied methylene bis-phenyl diisocyanate (MDI-L) and methylhexahydrophthalic anhydride (MHHPA). The chemical structure, cellular structure and thermal properties were respectively characterized by fourier transform infrared spectrometer (FTIR), scanning electron microscopy (SEM), thermomechanical analyzer (TMA) and thermogravimetric analyzer (TGA). Results showed that the foam had a uniform cellular structure, and cell size was about 760μm. The glass transition temperature (Tg) was 81oc and 5% weight loss temperature (T5d) was 252oc.
AB - High performance rigid cross-linked PVC foam has been prepared by molding process and boiling foam process with the main materials including polyvinyl chloride paste resin (PVC), liquefied methylene bis-phenyl diisocyanate (MDI-L) and methylhexahydrophthalic anhydride (MHHPA). The chemical structure, cellular structure and thermal properties were respectively characterized by fourier transform infrared spectrometer (FTIR), scanning electron microscopy (SEM), thermomechanical analyzer (TMA) and thermogravimetric analyzer (TGA). Results showed that the foam had a uniform cellular structure, and cell size was about 760μm. The glass transition temperature (Tg) was 81oc and 5% weight loss temperature (T5d) was 252oc.
KW - Cross-linked PVC foam
KW - Interpenetrating polymer network
KW - Low density
KW - Rigid
UR - http://www.scopus.com/inward/record.url?scp=80053034140&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.311-313.1056
DO - 10.4028/www.scientific.net/AMR.311-313.1056
M3 - 会议稿件
AN - SCOPUS:80053034140
SN - 9783037852149
T3 - Advanced Materials Research
SP - 1056
EP - 1060
BT - Advanced Materials and Processes
T2 - 2011 International Conference on Advanced Design and Manufacturing Engineering, ADME 2011
Y2 - 16 September 2011 through 18 September 2011
ER -