Preparation and properties of polystyrene/SiCw/SiCp thermal conductivity composites

Junwei Gu; Qiuyu Zhang; Jing Dang; Changjie Yin; Shaojie Chen

doi:10.1002/app.35089

Preparation and properties of polystyrene/SiCw/SiCp thermal conductivity composites

Junwei Gu, Qiuyu Zhang, Jing Dang, Changjie Yin, Shaojie Chen

School of Chemistry and Chemical Engineering

Northwestern Polytechnical University Xian

Research output: Contribution to journal › Article › peer-review

89 Scopus citations

Abstract

The silicon carbide whisker (SiCw) and silicon carbide particle (SiCp) were employed to prepare polystyrene/silicon carbide whisker/silicon carbide particle (PS/SiCw/SiCp) thermal conductivity composites, and the titanate coupling reagent of NDZ-105 was introduced to functionalize the surface of fillers. The thermal conductive coefficient Î improved from 0.18 W/mK for native PS to 1.29 W/mK for the composites with 40% volume fraction of SiCw/SiCp (volume fraction, 3: 1) hybrid fillers. Both the thermal decomposition temperature and dielectric constant of the composites increased with the addition of SiCw/SiCp hybrid fillers. At the same addition of SiCw/SiCp hybrid fillers, the surface modification of hybrid fillers by NDZ-105 could improve the thermal conductivity and the mechanical properties of the composites.

Original language	English
Pages (from-to)	132-137
Number of pages	6
Journal	Journal of Applied Polymer Science
Volume	124
Issue number	1
DOIs	https://doi.org/10.1002/app.35089
State	Published - 5 Apr 2012

Keywords

composites
hybrid fillers
polystyrene
thermal conductivity

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10.1002/app.35089

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title = "Preparation and properties of polystyrene/SiCw/SiCp thermal conductivity composites",

abstract = "The silicon carbide whisker (SiCw) and silicon carbide particle (SiCp) were employed to prepare polystyrene/silicon carbide whisker/silicon carbide particle (PS/SiCw/SiCp) thermal conductivity composites, and the titanate coupling reagent of NDZ-105 was introduced to functionalize the surface of fillers. The thermal conductive coefficient {\^I} improved from 0.18 W/mK for native PS to 1.29 W/mK for the composites with 40% volume fraction of SiCw/SiCp (volume fraction, 3: 1) hybrid fillers. Both the thermal decomposition temperature and dielectric constant of the composites increased with the addition of SiCw/SiCp hybrid fillers. At the same addition of SiCw/SiCp hybrid fillers, the surface modification of hybrid fillers by NDZ-105 could improve the thermal conductivity and the mechanical properties of the composites.",

keywords = "composites, hybrid fillers, polystyrene, thermal conductivity",

author = "Junwei Gu and Qiuyu Zhang and Jing Dang and Changjie Yin and Shaojie Chen",

year = "2012",

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T1 - Preparation and properties of polystyrene/SiCw/SiCp thermal conductivity composites

AU - Gu, Junwei

AU - Zhang, Qiuyu

AU - Dang, Jing

AU - Yin, Changjie

AU - Chen, Shaojie

PY - 2012/4/5

Y1 - 2012/4/5

N2 - The silicon carbide whisker (SiCw) and silicon carbide particle (SiCp) were employed to prepare polystyrene/silicon carbide whisker/silicon carbide particle (PS/SiCw/SiCp) thermal conductivity composites, and the titanate coupling reagent of NDZ-105 was introduced to functionalize the surface of fillers. The thermal conductive coefficient Î improved from 0.18 W/mK for native PS to 1.29 W/mK for the composites with 40% volume fraction of SiCw/SiCp (volume fraction, 3: 1) hybrid fillers. Both the thermal decomposition temperature and dielectric constant of the composites increased with the addition of SiCw/SiCp hybrid fillers. At the same addition of SiCw/SiCp hybrid fillers, the surface modification of hybrid fillers by NDZ-105 could improve the thermal conductivity and the mechanical properties of the composites.

AB - The silicon carbide whisker (SiCw) and silicon carbide particle (SiCp) were employed to prepare polystyrene/silicon carbide whisker/silicon carbide particle (PS/SiCw/SiCp) thermal conductivity composites, and the titanate coupling reagent of NDZ-105 was introduced to functionalize the surface of fillers. The thermal conductive coefficient Î improved from 0.18 W/mK for native PS to 1.29 W/mK for the composites with 40% volume fraction of SiCw/SiCp (volume fraction, 3: 1) hybrid fillers. Both the thermal decomposition temperature and dielectric constant of the composites increased with the addition of SiCw/SiCp hybrid fillers. At the same addition of SiCw/SiCp hybrid fillers, the surface modification of hybrid fillers by NDZ-105 could improve the thermal conductivity and the mechanical properties of the composites.

KW - composites

KW - hybrid fillers

KW - polystyrene

KW - thermal conductivity

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JO - Journal of Applied Polymer Science

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ER -

Preparation and properties of polystyrene/SiCw/SiCp thermal conductivity composites

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