Porosity and Young's modulus of pressure-less sintered silver nanoparticles

Xu Long, Wenbin Tang, Weijuan Xia, Yanpei Wu, Lianfeng Ren, Yao Yao

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

17 Scopus citations

Abstract

For harsh service conditions, sintered silver nanoparticles (AgNP) own the most appealing advantage of low temperature sintering and high temperature service. More importantly, sintered AgNP has superior high thermal and electrical conductivities compared with conventional solder materials, which will greatly benefit its application to packaging structures with high current density in advanced electronic devices. However, the microstructural morphology under different sintering conditions and the determination of Young's modulus of sintered AgNP with such a porous microstructure is imperative to be investigated. In the present study, the sintering condition for AgNP are firstly compared by applying pressure-less condition with the sintering temperature of 200°C for 90 min in two feasible approaches in practice, that is, electric forced-air heating oven and sintering furnace. To illustrate the superiority of sintered AgNP, the thermal conductivity is measured based on laser flash method and compared with conventional Sn-37Pb, Sn-3.0Ag-0.5Cu and silver electronic conductive adhesive. The formed microstructures based on both sintering conditions for different soldering structures are discussed in terms of porosity. Lastly, the Young's modulus of AgNP samples with a porous microstructure is determined using nanoindentation at different applied strain rates.

Original languageEnglish
Title of host publication2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-8
Number of pages8
ISBN (Electronic)9781538630426
DOIs
StatePublished - 2 Jul 2017
Event2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017 - Singapore, Singapore
Duration: 6 Dec 20179 Dec 2017

Publication series

Name2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
Volume2018-February

Conference

Conference2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017
Country/TerritorySingapore
CitySingapore
Period6/12/179/12/17

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