@inproceedings{2c4c65286cce4069a4b8fd69e940deca,
title = "Particle distribution characterization on material removal uniformity in chemical mechanical polishing",
abstract = "Chemical mechanical polishing (CMP) is the most important process for global planarization. The micro material removal and planarization of the optical surface is a complicated process, and the surface shape of optics is effected by kinematics, pressure, and chemical conditions. Moreover, it is a remarkable fact that the distribution characterization of polishing particles also has an important effect on material removal uniformity, especially for leather pad and Tin polishing lap. Large optics were always polished to a convex shape for the low density of valid abrasives in optic center. The porosity and grooves distribution of pad plays a major role in slurry delivering. The novel model of contact and material removal is presented in which pad characterization, and polishing particles delivery and distribution effects are included. With the modified pad asperity and optimized grooves, the particles have been inclined towards well-distributed, and experiments validated that the optic figure is significantly promoted.",
keywords = "Material removal uniformity, Pad characterization, Particle distribution",
author = "Shijie Zhao and Ruiqing Xie and Defeng Liao and Xianhua Chen and Qinghua Zhang and Jian Wang and Qiao Xu",
note = "Publisher Copyright: {\textcopyright} COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only.; Optifab 2019 ; Conference date: 14-10-2019 Through 17-10-2019",
year = "2019",
doi = "10.1117/12.2536289",
language = "英语",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Unger, {Blair L.} and Nelson, {Jessica DeGroote}",
booktitle = "Optifab 2019",
}