Abstract
Heat insulation is crucial to develop micromachined thermal sensors with high performance. By using FEA, typical heat insulation structures were studied, including the structure with different heat barrier layer beneath sensitive element, with or without cavity on silicon substrate, and using polymer as whole flexible substrate. Influence of heat insulation structures on sensor's sensitivity and response time was investigated,and the inherent mechanism was analysed. The research results are useful for design or optimization of micro thermal sensors.
| Original language | English |
|---|---|
| Pages (from-to) | 934-937 |
| Number of pages | 4 |
| Journal | Chinese Journal of Sensors and Actuators |
| Volume | 21 |
| Issue number | 6 |
| State | Published - Jun 2008 |
Keywords
- Heat insulation
- MEMS
- Response time
- Sensitivity
- Thermal sensor