Numerical Simulation of Impact Response of Board-Level Packaging Structure

Xu Long, Yuntao Hu, Tianxiong Su, Chao Chang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Board-level drop responses are critical to evaluate the mechanical reliability of solder joints to serve as electrical and mechanical connections in electronic devices to resist failure due to drop impact. In this paper, by applying the elastoplastic constitutive models of solder materials and polymer materials in the BGA packaging structure, drop impact simulations of board-level packaging structure are performed according to the new version of JEDEC revised in 2016, JESD22-B111A for the drop test standard for portable electronic products. Particularly, the Input-G method is adopted, using a semi-sinusoidal acceleration pulse load with a peak of 1500G and a pulse time of 0.5 ms. The overall finite element model establishes a 1/4 model thanks to the symmetry of the board-level packaging structure. According to the simulation results, we explored the failure mode of the solder joint and polymer layer. At the same time, the mechanical reliability of different solder joints in the packaging structure is also discussed according to the production requirements. The results show that the solder joint far away from the center point of the PCB board is subjected to the greatest stress, which is the most vulnerable solder joint. It is found that the stress component in the vertical direction plays a leading role, which can be treated as the peeling stress. Peeling stress is the major reason to cause the crack occurrence and propagation in the solder joint, which is the main failure mode for solder joint. Under the same load, three BGA models with different solder joint distributions are compared.

Original languageEnglish
Title of host publicationComputational and Experimental Simulations in Engineering - Proceedings of ICCES 2023—Volume 2
EditorsShaofan Li
PublisherSpringer Science and Business Media B.V.
Pages1443-1453
Number of pages11
ISBN (Print)9783031429866
DOIs
StatePublished - 2024
Externally publishedYes
Event29th International Conference on Computational and Experimental Engineering and Sciences, ICCES 2023 - Shenzhen, China
Duration: 26 May 202329 May 2023

Publication series

NameMechanisms and Machine Science
Volume145
ISSN (Print)2211-0984
ISSN (Electronic)2211-0992

Conference

Conference29th International Conference on Computational and Experimental Engineering and Sciences, ICCES 2023
Country/TerritoryChina
CityShenzhen
Period26/05/2329/05/23

Keywords

  • Board-level packaging structure
  • Drop impact
  • Dynamic response
  • Finite element method
  • Input-G method

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