Numerical investigation of heat transfer and pressure loss of double-layer microchannels for chip liquid cooling

Gongnan Xie, Yanquan Liu, Bengt Sunden, Weihong Zhang, Jun Zhao

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

8 Scopus citations

Abstract

The problem involved in the increase of the chip output power of high-performance integrated electronic devices is the failure of reliability because of excessive thermal loads. This requires advanced cooling methods to manage the increase of the dissipated heat. The traditional air-cooling may not meet the requirements, and therefore a new generation of liquid cooling technology becomes necessary. Various microchannels are widely used to cool the electronic chips by a gas or liquid, but these microchannels are often designed to be single-layer channels. In this paper, the laminar heat transfer and pressure loss in a kind of double-layer microchannel have been investigated numerically. The layouts of parallel-flow and counter-flow for inlet/outlet flow directions are designed and then several sets of inlet flowrates are considered. The simulations show that such a double-layer microchannel can not only reduce the pressure drop effectively but also exhibits better thermal characteristics, and the parallel-flow layout is found to be better for heat dissipation when the pumping power is limited, while the counter-flow layout is better when a high pumping power is provided.

Original languageEnglish
Title of host publicationASME 2012 Heat Transfer Summer Conf. Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012
Pages575-583
Number of pages9
DOIs
StatePublished - 2012
EventASME 2012 Heat Transfer Summer Conference Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012 - Rio Grande, Puerto Rico
Duration: 8 Jul 201212 Jul 2012

Publication series

NameASME 2012 Heat Transfer Summer Conf. Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012
Volume2

Conference

ConferenceASME 2012 Heat Transfer Summer Conference Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012
Country/TerritoryPuerto Rico
CityRio Grande
Period8/07/1212/07/12

Keywords

  • Double-layer
  • Liquid cooling
  • Microchannels
  • Numerical simulation

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