@inproceedings{4e5e325095c84a469057f481bb710ca1,
title = "New Cu-Ni substrate for coated conductors",
abstract = "A new approach of Cu-Ni substrate is reported, where the cubic textured Cu tape was fabricated by thermal-mechanical process, then a Ni layer was electro-deposited on the cubic textured Cu substrate. This approach is also suitable for fabricating long cubic textured metallic substrate for coated conductors. The formation of substrate texture and its thermal stability were investigated by XRD. After electro-depositing Ni layer, the sample has sharper cubic texture with Δω = 5.2° and ΔΦ = 7.1°, and samples' texture becames even better (Δω = 5 °and ΔΦ = 5.2°) after annealing at 950°C for 30min.",
keywords = "Cu-Ni substrate, Cubic texture, Electroplate",
author = "Yu, {Z. M.} and L. Zhou and P. Odier and Zhang, {P. X.}",
year = "2007",
doi = "10.4028/0-87849-432-4.1877",
language = "英语",
isbn = "0878494324",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd",
number = "PART 4",
pages = "1877--1880",
booktitle = "Progress in Light Metals, Aerospace Materials and Superconductors",
edition = "PART 4",
note = "2006 Beijing International Materials Week, 2006 BIMW - International Conference on Superconducting Materials, ICSM 2006 ; Conference date: 25-06-2006 Through 30-06-2006",
}