@inproceedings{e98fad101fcb44a2b6d294da2b8551ed,
title = "Multi-Chip 3D Integrated Micro-System Based on Microwave Multilayer",
abstract = "3D integrated vertical interconnection technology is an effective way to realize miniaturization, lightweight and high integration of electronic RF system. This paper introduces and verifies a hybrid interconnection structure that combines multiple types of chip stacking and flip chip welding in detail. The vertical interconnection of multiple types of chips and substrates is realized through two assembly methods of lead bonding and flip chip bonding. Finally, multiple active chips and passive devices are high-density integrated in a 60 mm × 60 mm × 1.5 mm active link volume. Compared with the traditional 2D packaging structure, the hybrid interconnection structure can reduce the packaging volume by more than 40% and increase the interconnection density by more than 2 times, effectively meeting the target requirements of miniaturization, functional diversification and rapid response of electronic system equipment.",
keywords = "3D integrated, Micro system, Multi-chip stacking",
author = "Cheng Yang and Zhenghu Zhu and Mengjie Hu and Chao Zhao and Xu Long",
note = "Publisher Copyright: {\textcopyright} The Author(s), under exclusive license to Springer Nature Switzerland AG 2024.; 29th International Conference on Computational and Experimental Engineering and Sciences, ICCES 2023 ; Conference date: 26-05-2023 Through 29-05-2023",
year = "2024",
doi = "10.1007/978-3-031-44947-5_95",
language = "英语",
isbn = "9783031449468",
series = "Mechanisms and Machine Science",
publisher = "Springer Science and Business Media B.V.",
pages = "1251--1258",
editor = "Shaofan Li",
booktitle = "Computational and Experimental Simulations in Engineering - Proceedings of ICCES 2023—Volume 3",
}