Molecular dynamics simulations on the low-temperature sintering of nano‑silver particles for electronic packaging

This study employs molecular dynamics simulations to investigate the low-temperature sintering process of nano‑silver particles and their resultant mechanical properties. By simulating the heating and sintering of silver at the nanoscale, the research aims to elucidate the thermal behavior and underlying sintering mechanisms of nano‑silver, which are critical for optimizing synthesis protocols and enhancing material performance. The simulations track the evolution of average atomic volume during heating, analyze structural transformations through pair distribution function analysis, and examine the consolidation of nano‑silver spheres under varying pressures at 500 K. Tensile tests at 300 K further evaluate the impact of sintering conditions on the material's strength and ductility. The results indicate that higher sintering pressures and temperatures yield denser nano‑silver structures with lower dislocation densities, enhancing tensile strength and modulus. Additionally, the study highlights the significant role of initial dislocation density in sintered silver in determining its mechanical behavior, contrasting with the defect-free single-crystal FCC-Ag. These findings provide valuable insights into the development of low-temperature sintering techniques for nano‑silver, paving the way for fabricating high-performance nanomaterials with broad applications in modern technology.