TY - JOUR
T1 - Microstructure evolution of ATI718 plus alloy during high-speed machining
T2 - Experiments and a combined FE-CA approach: Microstructure evolution of ATI718 plus alloy
AU - GAO, Xuhang
AU - YAO, Changfeng
AU - TAN, Liang
AU - CUI, Minchao
AU - TANG, Wenhao
AU - SHI, Guangyuan
AU - ZHAO, Jikang
AU - LUO, Jianxin
AU - ZHANG, Ya
N1 - Publisher Copyright:
© 2024
PY - 2024/12
Y1 - 2024/12
N2 - Excellent surface integrity is an eternal pursuit in high performance manufacturing, with microstructure being a crucial component of the surface integrity dataset and a key factor controlling surface properties such as fatigue and creep. The multi-physical fields generated by thermo-mechanical loads during high-speed machining act on the processed surface layer, influencing the evolution of microstructures. To investigate the microstructural evolution mechanisms of ATI718 plus during high-speed machining, cutting experiments and techniques such as Electron back scatter diffraction (EBSD), Transmission Kikuchi diffraction (TKD), and Precession electron diffraction (PED) is conducted to quantitatively analyze the microstructures in the chip shear zone and the machined surface. Subsequently, a combined finite element (FE) and cellular automata (CA) model is developed to simulate the microstructure evolution during the cutting process. The discontinuous dynamic recrystallization (DDRX) mechanism is employed to demonstrate the nucleation and growth of grains under the influence of multiple physical fields. The simulation and experimental results show similar dynamic recrystallization (DRX) grain sizes, indicating acceptable accuracy of the CA model in terms of DRX grain size. The comparison between experimental and simulation results confirms the occurrence of both continuous dynamic recrystallization (CDRX) and DDRX during the cutting process. The synergistic competition between CDRX induced grain lamellar refinement and DDRX induced grain growth emerge as the primary mechanism driving microstructural evolution. A layer of ultrafine grains, with a thickness within 20 μm, is formed on the machined surface. Results under different parameters demonstrate that the temperature has a more significant impact on the thickness of the ultrafine grain layer and the diameter of grains within the layer compared to the strain rate.
AB - Excellent surface integrity is an eternal pursuit in high performance manufacturing, with microstructure being a crucial component of the surface integrity dataset and a key factor controlling surface properties such as fatigue and creep. The multi-physical fields generated by thermo-mechanical loads during high-speed machining act on the processed surface layer, influencing the evolution of microstructures. To investigate the microstructural evolution mechanisms of ATI718 plus during high-speed machining, cutting experiments and techniques such as Electron back scatter diffraction (EBSD), Transmission Kikuchi diffraction (TKD), and Precession electron diffraction (PED) is conducted to quantitatively analyze the microstructures in the chip shear zone and the machined surface. Subsequently, a combined finite element (FE) and cellular automata (CA) model is developed to simulate the microstructure evolution during the cutting process. The discontinuous dynamic recrystallization (DDRX) mechanism is employed to demonstrate the nucleation and growth of grains under the influence of multiple physical fields. The simulation and experimental results show similar dynamic recrystallization (DRX) grain sizes, indicating acceptable accuracy of the CA model in terms of DRX grain size. The comparison between experimental and simulation results confirms the occurrence of both continuous dynamic recrystallization (CDRX) and DDRX during the cutting process. The synergistic competition between CDRX induced grain lamellar refinement and DDRX induced grain growth emerge as the primary mechanism driving microstructural evolution. A layer of ultrafine grains, with a thickness within 20 μm, is formed on the machined surface. Results under different parameters demonstrate that the temperature has a more significant impact on the thickness of the ultrafine grain layer and the diameter of grains within the layer compared to the strain rate.
KW - Cellular automata
KW - Dynamic recrystallization
KW - Finite element
KW - High-speed machining
KW - Microstructure evolution
KW - Surface integrity
UR - http://www.scopus.com/inward/record.url?scp=85208015342&partnerID=8YFLogxK
U2 - 10.1016/j.cja.2024.05.022
DO - 10.1016/j.cja.2024.05.022
M3 - 文章
AN - SCOPUS:85208015342
SN - 1000-9361
VL - 37
SP - 498
EP - 521
JO - Chinese Journal of Aeronautics
JF - Chinese Journal of Aeronautics
IS - 12
ER -