Microstructure evolution and room temperature fracture toughness of an integrally directionally solidified Nb-Ti-Si based ultrahigh temperature alloy

Haisheng Guo; Xiping Guo

doi:10.1016/j.scriptamat.2010.12.008

Microstructure evolution and room temperature fracture toughness of an integrally directionally solidified Nb-Ti-Si based ultrahigh temperature alloy

Haisheng Guo, Xiping Guo

School of Materials Sience and Engineering

Northwestern Polytechnical University Xian

Research output: Contribution to journal › Article › peer-review

124 Scopus citations

Abstract

Integrally directional solidification of an Nb-Ti-Si based ultrahigh temperature alloy was performed at 2000 °C with withdrawal rates varying from 2.5 to 100 μm s^-1. The directionally solidified microstructure was composed of primary silicides and eutectic colonies that distributed evenly and aligned erectly along the growth direction. Both the average diameter and the lamellar spacing of eutectic cells decreased with increasing withdrawal rate. The room temperature fracture toughness was improved significantly by integrally directional solidification.

Original language	English
Pages (from-to)	637-640
Number of pages	4
Journal	Scripta Materialia
Volume	64
Issue number	7
DOIs	https://doi.org/10.1016/j.scriptamat.2010.12.008
State	Published - Apr 2011

Keywords

Directional solidification
Fracture toughness
Nb-Ti-Si based alloy
Solidification microstructure

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10.1016/j.scriptamat.2010.12.008

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title = "Microstructure evolution and room temperature fracture toughness of an integrally directionally solidified Nb-Ti-Si based ultrahigh temperature alloy",

abstract = "Integrally directional solidification of an Nb-Ti-Si based ultrahigh temperature alloy was performed at 2000 °C with withdrawal rates varying from 2.5 to 100 μm s-1. The directionally solidified microstructure was composed of primary silicides and eutectic colonies that distributed evenly and aligned erectly along the growth direction. Both the average diameter and the lamellar spacing of eutectic cells decreased with increasing withdrawal rate. The room temperature fracture toughness was improved significantly by integrally directional solidification.",

keywords = "Directional solidification, Fracture toughness, Nb-Ti-Si based alloy, Solidification microstructure",

author = "Haisheng Guo and Xiping Guo",

year = "2011",

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AU - Guo, Xiping

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N2 - Integrally directional solidification of an Nb-Ti-Si based ultrahigh temperature alloy was performed at 2000 °C with withdrawal rates varying from 2.5 to 100 μm s-1. The directionally solidified microstructure was composed of primary silicides and eutectic colonies that distributed evenly and aligned erectly along the growth direction. Both the average diameter and the lamellar spacing of eutectic cells decreased with increasing withdrawal rate. The room temperature fracture toughness was improved significantly by integrally directional solidification.

AB - Integrally directional solidification of an Nb-Ti-Si based ultrahigh temperature alloy was performed at 2000 °C with withdrawal rates varying from 2.5 to 100 μm s-1. The directionally solidified microstructure was composed of primary silicides and eutectic colonies that distributed evenly and aligned erectly along the growth direction. Both the average diameter and the lamellar spacing of eutectic cells decreased with increasing withdrawal rate. The room temperature fracture toughness was improved significantly by integrally directional solidification.

KW - Directional solidification

KW - Fracture toughness

KW - Nb-Ti-Si based alloy

KW - Solidification microstructure

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DO - 10.1016/j.scriptamat.2010.12.008

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SN - 1359-6462

VL - 64

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EP - 640

JO - Scripta Materialia

JF - Scripta Materialia

IS - 7

ER -

Microstructure evolution and room temperature fracture toughness of an integrally directionally solidified Nb-Ti-Si based ultrahigh temperature alloy

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Keywords

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