Microstructure dependence of electrochemical corrosion resistance for rapidly solidified Ti₅₀Al₄₈Mo₂ alloy

The rapid solidification of undercooled liquid Ti₅₀Al₄₈Mo₂ alloy was achieved by the electromagnetic levitation (EML) technique. At small and medium undercoolings, primary (βTi) dendrite reacted with surrounding liquid to drive a peritectic transformation into the (αTi) phase. The solutal Mo and Al segregations were located within the dendrite center and the grain boundary during peritectic transformation, consequently B2 phase in the dendrite center and γ phase at the grain boundary formed. Once undercooling exceeded 253 K, the peritectic transformation was completely inhibited, and the formation of the B2 phase and γ phase was completely suppressed. The ultrafine eutectoid structure was formed and a complete solute trapping effect was realized. Homogeneous solute distribution facilitated the formation of thicker passivation film with lower defect density and higher film resistance on the alloy surface. Moreover, this weakened micro-galvanic effect reduced the susceptibility to pitting corrosion, and consequently the corrosion resistance of the alloy was improved.