Microstructure and the dielectric properties of SiCN-Si3N 4 ceramics fabricated via LPCVD/CVI

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Abstract

SiCN-Si3N4 ceramics were fabricated by infiltrating SiCN into porous Si3N4 ceramics with different flux ratio of precursor gases via low-pressure chemical vapor deposition/infiltration (LPCVD/CVI). Several methods of characterization were employed to discuss the effects of different precursor gases ratio on the microstructure and dielectric properties of fabricated SiCN-Si3N4 ceramics. The deposition product is amorphous and mainly consists of SiN, CC and SiC bonds. In SiCN-Si3N4 ceramics, free carbon disperses uniformly in the amorphous and low-conductivity SiCN, which results in suitable dielectric properties. The mean real part (ε′) and imaginary part (ε") of permittivity increase from 3.82 and 0.05 to 7.71 and 6.94, respectively. The dielectric loss (tan δ) can be controlled from 0.014 to 0.899 by changing the flux ratio of C3H6.

Original languageEnglish
Pages (from-to)5097-5102
Number of pages6
JournalCeramics International
Volume40
Issue number3
DOIs
StatePublished - Apr 2014

Keywords

  • Amorphous
  • Chemical vapor deposition/infiltration
  • Dielectric materials/properties
  • Silicon carbonitride

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