TY - JOUR
T1 - Microstructure and Properties of C/SiC-Diamond Composites Prepared by the Combination of CVI and RMI
AU - Li, Jingxin
AU - Liu, Yongsheng
AU - Nan, Beiya
AU - Zhao, Zhifeng
AU - Feng, Wei
AU - Zhang, Qing
AU - Cheng, Laifei
N1 - Publisher Copyright:
© 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
PY - 2019/5
Y1 - 2019/5
N2 - Diamond modified continuous carbon fiber reinforced silicon carbide (C/SiC-Diamond) composites are prepared using a combination of chemical vapor infiltration (CVI) and reactive melt infiltration (RMI). The effect of the diamond particle size on the microstructure, mechanical properties, and thermophysical properties of C/SiC-Diamond composites are investigated. A density of 2.05 g cm−3 is achieved for C/SiC-Diamond composites impregnated with 1 µm diamond particles. A near twofold enhancement of the thermal conductivity (9–10 W (m K)−1) and thermal diffusion coefficient (5 mm2 s−1) is obtained, compared with continuous carbon fiber reinforced silicon carbide (C/SiC) composites (5–6 W (m · K)−1) prepared by CVI. It is established that the introduction of diamond can improve the thermal conductivity of C/SiC composites and increase the application potential in rocket engines, aerospace vehicles, and brake materials.
AB - Diamond modified continuous carbon fiber reinforced silicon carbide (C/SiC-Diamond) composites are prepared using a combination of chemical vapor infiltration (CVI) and reactive melt infiltration (RMI). The effect of the diamond particle size on the microstructure, mechanical properties, and thermophysical properties of C/SiC-Diamond composites are investigated. A density of 2.05 g cm−3 is achieved for C/SiC-Diamond composites impregnated with 1 µm diamond particles. A near twofold enhancement of the thermal conductivity (9–10 W (m K)−1) and thermal diffusion coefficient (5 mm2 s−1) is obtained, compared with continuous carbon fiber reinforced silicon carbide (C/SiC) composites (5–6 W (m · K)−1) prepared by CVI. It is established that the introduction of diamond can improve the thermal conductivity of C/SiC composites and increase the application potential in rocket engines, aerospace vehicles, and brake materials.
KW - C/SiC-Diamond composites
KW - reactive melt infiltration
KW - thermal conductivity
UR - http://www.scopus.com/inward/record.url?scp=85055248287&partnerID=8YFLogxK
U2 - 10.1002/adem.201800765
DO - 10.1002/adem.201800765
M3 - 文章
AN - SCOPUS:85055248287
SN - 1438-1656
VL - 21
JO - Advanced Engineering Materials
JF - Advanced Engineering Materials
IS - 5
M1 - 1800765
ER -