Microstructure and dielectric properties of chopping SiCf/LAS composites

The chopping SiCf/LAS composites were prepared by the hot-pressing method. The effects of hot-pressing time and pressures on the microstructures and the dielectric properties of the composites were researched. Compared with the LAS matrix and the SiC fibre, the results of dielectric constant testing in the range of 8-12 GHz indicate that the dielectric constant real part, imaginary part and dielectric dissipation of all samples increase by 1-3 orders of magnitude, and show obvious frequency dispersion effect. Their real parts increase while their imaginary parts and dielectric dissipations decline with the increase of the hot-pressing time or pressures. The SEM fractographs show that the composite interfacial films between the fibre and the matrix are thickened with the increase of the hot-pressing time or pressures.