Low-cost, high-performance fiber optic fabry–Perot sensor for ultrasonic wave detection

Haoyong Li; Delin Li; Chaoyu Xiong; Wenrong Si; Chenzhao Fu; Peng Yuan; Yiting Yu

doi:10.3390/s19020406

Low-cost, high-performance fiber optic fabry–Perot sensor for ultrasonic wave detection

Haoyong Li, Delin Li, Chaoyu Xiong, Wenrong Si, Chenzhao Fu, Peng Yuan, Yiting Yu

School of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

31 Scopus citations

Abstract

This study describes a novel fiber optic extrinsic Fabry–Perot interferometric (EFPI) ultrasonic sensor comprising a low-cost and high-performance silicon diaphragm. A vibrating diaphragm, 5 μm thick, was fabricated by using the Microelectromechanical Systems (MEMS) processing technology on a silicon-on-insulator (SOI) wafer. The Fabry–Perot (FP) cavity length was solely determined during the manufacturing process of the diaphragm by defining a specific stepped hole on the handling layer of the SOI wafer, which made the assembly of the sensor easier. In addition, the use of cheap and commercially available components and MEMS processing technology in the development of the sensing system, limited the cost of the sensor. The experimental tests showed that the minimum detectable ultrasonic pressure was 1.5 mPa/sqrt(Hz) –0.625 mPa/sqrt(Hz) between 20 kHz and 40 kHz. As a result, this sensor has the potential to successfully detect weak ultrasonic signals.

Original language	English
Article number	406
Journal	Sensors
Volume	19
Issue number	2
DOIs	https://doi.org/10.3390/s19020406
State	Published - 2 Jan 2019

Keywords

Fabry-Perot
Fiber optic sensors
Ultrasonic pressure detection

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10.3390/s19020406

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title = "Low-cost, high-performance fiber optic fabry–Perot sensor for ultrasonic wave detection",

abstract = "This study describes a novel fiber optic extrinsic Fabry–Perot interferometric (EFPI) ultrasonic sensor comprising a low-cost and high-performance silicon diaphragm. A vibrating diaphragm, 5 μm thick, was fabricated by using the Microelectromechanical Systems (MEMS) processing technology on a silicon-on-insulator (SOI) wafer. The Fabry–Perot (FP) cavity length was solely determined during the manufacturing process of the diaphragm by defining a specific stepped hole on the handling layer of the SOI wafer, which made the assembly of the sensor easier. In addition, the use of cheap and commercially available components and MEMS processing technology in the development of the sensing system, limited the cost of the sensor. The experimental tests showed that the minimum detectable ultrasonic pressure was 1.5 mPa/sqrt(Hz) –0.625 mPa/sqrt(Hz) between 20 kHz and 40 kHz. As a result, this sensor has the potential to successfully detect weak ultrasonic signals.",

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AU - Li, Haoyong

AU - Li, Delin

AU - Xiong, Chaoyu

AU - Si, Wenrong

AU - Fu, Chenzhao

AU - Yuan, Peng

AU - Yu, Yiting

PY - 2019/1/2

Y1 - 2019/1/2

N2 - This study describes a novel fiber optic extrinsic Fabry–Perot interferometric (EFPI) ultrasonic sensor comprising a low-cost and high-performance silicon diaphragm. A vibrating diaphragm, 5 μm thick, was fabricated by using the Microelectromechanical Systems (MEMS) processing technology on a silicon-on-insulator (SOI) wafer. The Fabry–Perot (FP) cavity length was solely determined during the manufacturing process of the diaphragm by defining a specific stepped hole on the handling layer of the SOI wafer, which made the assembly of the sensor easier. In addition, the use of cheap and commercially available components and MEMS processing technology in the development of the sensing system, limited the cost of the sensor. The experimental tests showed that the minimum detectable ultrasonic pressure was 1.5 mPa/sqrt(Hz) –0.625 mPa/sqrt(Hz) between 20 kHz and 40 kHz. As a result, this sensor has the potential to successfully detect weak ultrasonic signals.

AB - This study describes a novel fiber optic extrinsic Fabry–Perot interferometric (EFPI) ultrasonic sensor comprising a low-cost and high-performance silicon diaphragm. A vibrating diaphragm, 5 μm thick, was fabricated by using the Microelectromechanical Systems (MEMS) processing technology on a silicon-on-insulator (SOI) wafer. The Fabry–Perot (FP) cavity length was solely determined during the manufacturing process of the diaphragm by defining a specific stepped hole on the handling layer of the SOI wafer, which made the assembly of the sensor easier. In addition, the use of cheap and commercially available components and MEMS processing technology in the development of the sensing system, limited the cost of the sensor. The experimental tests showed that the minimum detectable ultrasonic pressure was 1.5 mPa/sqrt(Hz) –0.625 mPa/sqrt(Hz) between 20 kHz and 40 kHz. As a result, this sensor has the potential to successfully detect weak ultrasonic signals.

KW - Fabry-Perot

KW - Fiber optic sensors

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Low-cost, high-performance fiber optic fabry–Perot sensor for ultrasonic wave detection

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Keywords

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