Abstract
The surface plastic deformation was applied to high Nb containing TiAl alloy by means of shot peening, and the influence of the surface plastic deformation on the microstructure evolution of the diffusion bonding interface of high Nb containing TiAl alloy was studied. The results indicated that continuous α2 phase formed in the bonding interface with surface plastic deformation, and the fraction of α2 phase increased with the increasing deformation degree. Furthermore, the surface plastic deformation promotes the recrystallization in the subsequent annealing. The growth of the recrystallized grain reduced the fraction of α2 phase when the plastic deformation is large enough, and the α2 phase disappeared at last. Thus, the combined surface plastic deformation with recrystallization annealing improved the bonding quality of high Nb containing TiAl alloy.
Original language | English |
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Pages (from-to) | 23-27 |
Number of pages | 5 |
Journal | Suxing Gongcheng Xuebao/Journal of Plasticity Engineering |
Volume | 21 |
Issue number | 4 |
DOIs | |
State | Published - 28 Aug 2014 |
Keywords
- Diffusion bonding
- High Nb containing TiAl alloy
- Recrystallization annealing
- Surface plastic deformation