TY - GEN
T1 - Improving the Performance of MEMS Resonant Sensors with Synchronized Piezoresistive/Capacitive Transductions using Signal Fusion
AU - Li, Chengxin
AU - Wu, Fan
AU - Zhao, Chun
AU - Zhang, Hemin
AU - Torunbalci, Mustafa Mert
AU - Wang, Chen
AU - De Strycker, Lieven
AU - Kraft, Michael
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - This paper presents a novel MEMS resonant sensor simultaneously employing piezoresistive and capacitive transductions to generate high-correlation intrinsic noise and signal outputs. The design enables significant flicker noise reduction with a generic recursive filter. The sensor features a double tuning-ending fork resonator with dual piezoresistive gauges that transduces the signals synchronously via both piezoresistive and capacitive mechanisms. The synchronized signals extracted from the two transduction mechanisms are fused with a Kalman filter implemented in a FPGA. The experimental results demonstrate a frequency bias instability of 1.9 ppb with the application of signal fusion, which is a 20-fold improvement compared to using capacitive transduction alone.
AB - This paper presents a novel MEMS resonant sensor simultaneously employing piezoresistive and capacitive transductions to generate high-correlation intrinsic noise and signal outputs. The design enables significant flicker noise reduction with a generic recursive filter. The sensor features a double tuning-ending fork resonator with dual piezoresistive gauges that transduces the signals synchronously via both piezoresistive and capacitive mechanisms. The synchronized signals extracted from the two transduction mechanisms are fused with a Kalman filter implemented in a FPGA. The experimental results demonstrate a frequency bias instability of 1.9 ppb with the application of signal fusion, which is a 20-fold improvement compared to using capacitive transduction alone.
KW - flicker noise reduction
KW - Kalman filter
KW - piezoresistive gauges
KW - Synchronized transduction
UR - http://www.scopus.com/inward/record.url?scp=105001661929&partnerID=8YFLogxK
U2 - 10.1109/MEMS61431.2025.10918189
DO - 10.1109/MEMS61431.2025.10918189
M3 - 会议稿件
AN - SCOPUS:105001661929
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 946
EP - 949
BT - 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems, MEMS 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 38th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2025
Y2 - 19 January 2025 through 23 January 2025
ER -