Implantable thin film devices as brain‐computer interfaces: Recent advances in design and fabrication approaches

Remarkable progress has been made in the high resolution, biocompatibility, durability and stretchability for the implantable brain‐computer interface (BCI) in the last decades. Due to the inevitable damage of brain tissue caused by traditional rigid devices, the thin film devices are developing rapidly and attracting considerable attention, with continuous progress in flexible materials and non‐silicon micro/nano fabrication methods. Therefore, it is necessary to systematically summarize the recent development of implantable thin film devices for acquiring brain information. This brief review subdivides the flexible thin film devices into the following four categories: planar, open‐mesh, probe, and micro‐wire layouts. In addition, an overview of the fabrication approaches is also presented. Traditional lithography and state‐of‐the‐art processing methods are discussed for the key issue of high‐resolution. Special substrates and interconnects are also highlighted with varied materials and fabrication routines. In conclusion, a discussion of the remaining obstacles and directions for future research is provided.