Abstract
In contrast to fusion-based additive manufacturing (AM) methods, cold spray (CS) is a solid-state metal powder deposition process that has evolved from a traditional coating method to a novel AM technique, i.e. CSAM, for fabricating components and repairing damaged parts. In this study, we demonstrate that the long-standing low ductility of CSAM metallic deposits can be addressed through constructing a unique microstructure. A Cu deposit with 29.7% in elongation and 270 MPa in tensile strength has been produced using a proper spray parameter set. The high ductility of the Cu deposit originates from grain rotation and merging during tensile deformation, which is facilitated by twin boundaries acting as a bridge to dislocations slip. The understanding of high-ductility Cu deposits may help develop other high-strength and high-ductility CSAM metallic materials.
Original language | English |
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Pages (from-to) | 11-15 |
Number of pages | 5 |
Journal | Journal of Materials Science and Technology |
Volume | 214 |
DOIs | |
State | Published - 10 Apr 2025 |
Keywords
- Cold spray additive manufacturing
- Copper
- Grain growth
- High ductility
- Twin