TY - JOUR
T1 - Hexagonal boron nitride/polymethyl-vinyl siloxane rubber dielectric thermally conductive composites with ideal thermal stabilities
AU - Gu, Junwei
AU - Meng, Xudong
AU - Tang, Yusheng
AU - Li, Yang
AU - Zhuang, Qiang
AU - Kong, Jie
N1 - Publisher Copyright:
© 2016 Elsevier Ltd
PY - 2017/1/1
Y1 - 2017/1/1
N2 - Hexagonal boron nitride/polymethyl-vinyl siloxane rubber (hBN/VMQ) dielectric thermally conductive composites were fabricated via kneading followed by hot compression method. The thermally conductive coefficient (λ), thermal diffusion coefficient (α), dielectric constant (ε) and dielectric loss tangent (tan δ) values were all increased with the increasing addition of hBN fillers. When the volume fraction of hBN fillers was 40 vol%, the corresponding λ and α was 1.110 W/m K and 1.174 mm2/s, 6 and 9 times than that of pure VMQ matrix, respectively. The corresponding ε and tan δ was 3.51 and 0.0054, respectively. Furthermore, the tensile strength and THeat-resistance index (THRI) values were both maximum with 20 vol% hBN fillers, tensile strength of 3.31 MPa, 12 times than that of pure VMQ matrix (0.28 MPa), and THRI of 253.8 °C. The obtained hBN/VMQ composites present great potential for packaging in continuous integration and miniaturization of microelectronic devices.
AB - Hexagonal boron nitride/polymethyl-vinyl siloxane rubber (hBN/VMQ) dielectric thermally conductive composites were fabricated via kneading followed by hot compression method. The thermally conductive coefficient (λ), thermal diffusion coefficient (α), dielectric constant (ε) and dielectric loss tangent (tan δ) values were all increased with the increasing addition of hBN fillers. When the volume fraction of hBN fillers was 40 vol%, the corresponding λ and α was 1.110 W/m K and 1.174 mm2/s, 6 and 9 times than that of pure VMQ matrix, respectively. The corresponding ε and tan δ was 3.51 and 0.0054, respectively. Furthermore, the tensile strength and THeat-resistance index (THRI) values were both maximum with 20 vol% hBN fillers, tensile strength of 3.31 MPa, 12 times than that of pure VMQ matrix (0.28 MPa), and THRI of 253.8 °C. The obtained hBN/VMQ composites present great potential for packaging in continuous integration and miniaturization of microelectronic devices.
KW - A. Polymer-matrix composites (PMCs)
KW - B. Thermal properties
KW - D. Compression moulding
UR - http://www.scopus.com/inward/record.url?scp=84994639307&partnerID=8YFLogxK
U2 - 10.1016/j.compositesa.2016.11.002
DO - 10.1016/j.compositesa.2016.11.002
M3 - 文章
AN - SCOPUS:84994639307
SN - 1359-835X
VL - 92
SP - 27
EP - 32
JO - Composites Part A: Applied Science and Manufacturing
JF - Composites Part A: Applied Science and Manufacturing
ER -